Material Content Data Sheet
Sales Product Name IDH08SG60C
Issued
29. August 2013
1966.16 mg
MA#
MA000629798
PG-TO220-2-1
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
1.433
1.343
0.07
0.07
0.02
68.23
0.06
0.46
5.08
25.26
0.74
0.01
0.00
0.07
729
683
729
leadframe
iron
phosphorus
copper
0.403
205
1341.263
1.271
68.32
0.06
682175
646
683063
646
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
9.086
4621
50835
252637
7368
101
99.950
496.723
14.487
0.198
inorganic material
non noble metal
non noble metal
inorganic material
< 10%
60676-86-0
7440-31-5
7440-02-0
7723-14-0
30.80
0.74
308093
7368
leadfinish
plating
nickel
phosphorus
0.000
0.01
0
101
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com