Material Content Data Sheet
Sales Product Name TDA5101
Issued
28. August 2013
59.72 mg
MA#
MA000217108
Package
PG-TSSOP-16-1
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
1.497
8.109
11.199
0.448
0.108
4.582
31.389
0.915
0.856
0.136
0.482
2.51
13.58
18.75
0.75
0.18
7.67
52.56
1.53
1.43
0.23
0.81
2.51
25060
135786
187514
7498
25060
leadframe
nickel
iron
32.33
0.75
323300
7498
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1812
76724
525591
15318
14339
2279
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
60.41
1.53
1.43
604127
15318
14339
leadfinish
plating
glue
silver
plastics
acrylic resin
silver
noble metal
7440-22-4
1.04
8079
10358
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com