Material Content Data Sheet
Sales Product Name BFN 26 E6327
Issued
29. August 2013
8.71 mg
MA#
MA000049196
PG-SOT23-3-3
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
non noble metal
noble metal
arsenic
7440-38-2
7440-57-5
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
1309-64-4
-
0.000
0.019
0.160
1.142
1.578
0.019
0.089
0.133
0.166
1.384
3.765
0.150
0.107
0.00
0.21
1.84
13.11
18.11
0.22
1.02
1.53
1.91
15.89
43.21
1.72
1.23
22
gold
2149
inorganic material
non noble metal
non noble metal
noble metal
silicon
2.05
18350
131148
181109
2192
20521
leadframe
nickel
iron
31.22
0.22
312257
2192
wire
gold
encapsulation
organic material
inorganic material
plastics
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
10169
15254
19067
158894
432192
17179
12275
plastics
-
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
63.56
1.72
1.23
635576
17179
leadfinish
plating
silver
12275
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com