Material Content Data Sheet
Sales Product Name DSL70 E6327
Issued
29. August 2013
11.92 mg
MA#
MA000787194
Package
PG-SOT143-4-10
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
non noble metal
noble metal
arsenic
7440-38-2
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
1309-64-4
-
0.000
0.018
0.102
0.001
0.005
0.015
4.981
0.108
0.102
0.152
0.190
1.587
4.317
0.217
0.122
0.00
0.15
0.86
0.01
0.04
0.13
41.79
0.91
0.85
1.28
1.60
13.32
36.22
1.82
1.02
15
gold
1508
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
1.01
8583
84
10106
leadframe
silicon
titanium
420
chromium
copper
1259
41.97
0.91
417929
9077
419692
9077
wire
gold
encapsulation
organic material
inorganic material
plastics
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
8523
12785
15981
133176
362237
18174
10249
plastics
-
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
53.27
1.82
1.02
532702
18174
leadfinish
plating
silver
10249
*deviation
< 10%
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com