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M74HC07RM13TR PDF预览

M74HC07RM13TR

更新时间: 2024-11-20 22:23:15
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
10页 230K
描述
HEX BUFFER OPEN DRAIN

M74HC07RM13TR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SO-14针数:14
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.84系列:HC/UH
JESD-30 代码:R-PDSO-G14JESD-609代码:e4
长度:8.65 mm负载电容(CL):50 pF
逻辑集成电路类型:BUFFER最大I(ol):0.004 A
功能数量:6输入次数:1
端子数量:14最高工作温度:125 °C
最低工作温度:-55 °C输出特性:OPEN-DRAIN
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:2/6 VProp。Delay @ Nom-Sup:27 ns
传播延迟(tpd):135 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.75 mm
子类别:Gates最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):4.5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

M74HC07RM13TR 数据手册

 浏览型号M74HC07RM13TR的Datasheet PDF文件第2页浏览型号M74HC07RM13TR的Datasheet PDF文件第3页浏览型号M74HC07RM13TR的Datasheet PDF文件第4页浏览型号M74HC07RM13TR的Datasheet PDF文件第5页浏览型号M74HC07RM13TR的Datasheet PDF文件第6页浏览型号M74HC07RM13TR的Datasheet PDF文件第7页 
M74HC07  
HEX BUFFER (OPEN DRAIN)  
HIGH SPEED:  
= 6ns (TYP.) at V = 6V  
t
PD  
CC  
LOW POWER DISSIPATION:  
= 1µA(MAX.) at T =25°C  
I
CC  
A
HIGH NOISE IMMUNITY:  
= V = 28 % V (MIN.)  
V
NIH  
NIL  
CC  
DIP  
SOP  
TSSOP  
T & R  
WIDE OPERATING VOLTAGE RANGE:  
(OPR) = 2V to 6V  
V
CC  
PIN AND FUNCTION COMPATIBLE WITH  
74 SERIES 07  
ORDER CODES  
PACKAGE  
TUBE  
DIP  
SOP  
M74HC07B1R  
M74HC07M1R  
DESCRIPTION  
M74HC07RM13TR  
M74HC07TTR  
The M74HC07 is an high speed CMOS HEX  
OPEN DRAIN BUFFER fabricated with silicon  
TSSOP  
2
gate C MOS technology.  
The internal circuit is composed of 2 stages  
including buffer output, which enables high noise  
immunity and stable output.  
All inputs are equipped with protection circuits  
against static discharge and transient excess  
voltage.  
PIN CONNECTION AND IEC LOGIC SYMBOLS  
May 2003  
1/10  

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