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M5M29GB800AVP-10I PDF预览

M5M29GB800AVP-10I

更新时间: 2024-11-21 20:59:43
品牌 Logo 应用领域
三菱 - MITSUBISHI 光电二极管内存集成电路
页数 文件大小 规格书
22页 253K
描述
Flash, 512KX16, 100ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

M5M29GB800AVP-10I 技术参数

生命周期:Obsolete零件包装代码:TSOP1
包装说明:12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48针数:48
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:5.84
最长访问时间:100 ns备用内存宽度:8
启动块:BOTTOMJESD-30 代码:R-PDSO-G48
长度:18.4 mm内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:48
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL编程电压:3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL类型:NOR TYPE
宽度:12 mmBase Number Matches:1

M5M29GB800AVP-10I 数据手册

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MITSUBISHI LSIs  
M5M29GB/T800AVP,RV
8,388,608-BIT (1048,576-WORD BY 8-BIT / 524,288-WORD BY16-BIT)  
CMOS 3.3V-ONLY, BLOCK ERASE FLASH MEMORY  
DESCRIPTION  
The MITSUBISHI Mobile FLASH M5M29GB/T800AVP, RV are 3.3V-only high speed 8,388,608-bit CMOS boot block Flash Memories with  
alternating BGO (Back Ground Operation) feature. The BGO feature of the device allows Program or Erase operations to be performed in  
one bank while the device simultaneously allows Read operations to be performed on the other bank. This BGO feature is suitable for  
mobile and personal computing, and communication products. The M5M29GB/T800AVP, RV are fabricated by CMOS technology for the  
peripheral circuits and DINOR(Divided bit line NOR) architecture for the memory cells, and are available in 48pin TSOP(I) .  
FEATURES  
Organization  
.................................  
.................................  
524,288 word x 16bit  
1,048,576 word x 8 bit  
VCC = 2.7~3.6V  
Boot Block  
M5M29GB800AVP,RV  
M5M29GT800AVP,RV  
...........................  
...........................  
Bottom Boot  
Top Boot  
.............................  
Supply voltage ................................  
Other Functions  
..............................  
..............................  
Access time  
-80  
80ns : Vcc=3.0V  
100ns : Vcc=2.7V  
Soft Ware Command Control  
Selective Block Lock  
Erase Suspend/Resume  
Program Suspend/Resume  
Status Register Read  
-1I 100ns : Vcc=3.0V  
120ns : Vcc=2.7V  
Power Dissipation  
Read  
Alternating Back Ground Program/Erase Operation  
Between Bank(I) and Bank(II)  
.................................  
.........  
.................................  
72 mW (Max. at 5MHz)  
0.33µW (typ.)  
(After Automatic Power saving)  
Package  
Program/Erase  
144 mW (Max.)  
0.33µW (typ.)  
48-Lead, 12mm x 20mm TSOP (type-I)  
.........................................  
Standby  
.......................  
Deep power down mode  
Auto program for Bank(I)  
0.33µW (typ.)  
.................................  
Program Time  
Program Unit  
4ms (typ.)  
.........................  
.........................  
APPLICATION  
(Byte Program)  
(Page Program)  
Auto program for Bank(II)  
1word/1byte  
Code Storage PC BIOS  
128word/256byte  
Digital Cellular Phone/Telecommunication  
.................................  
.................................  
Program Time  
Program Unit  
Auto Erase  
Erase time  
4ms (typ.)  
128word/256byte  
.................................  
.....................  
40 ms (typ.)  
Erase Unit  
Bank(I) Boot Block  
8Kword/16Kbyte x 1  
4Kword/8Kbyte x 6  
32Kword/64Kbyte x 15  
..............  
......................  
Parameter Block  
Bank(II) Main Block  
.........................................  
Program/Erase cycles  
100Kcycles  
PIN CONFIGURATION (TOP VIEW)  
800AVP  
800AVP  
800ARV  
800ARV  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
A16  
A16  
BYTE#  
GND  
DQ15/A-1  
DQ7  
1
2
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
A15  
A14  
A13  
A12  
A11  
A10  
A9  
A15  
A14  
A13  
A12  
A11  
A10  
A9  
BYTE#  
GND  
DQ15/A-1  
DQ7  
3
3
4
4
5
5
6
6
DQ14  
DQ6  
DQ14  
DQ6  
7
7
8
8
DQ13  
DQ5  
DQ13  
DQ5  
A8  
A8  
9
9
NC  
NC  
WE#  
RP#  
NC  
NC  
NC  
WE#  
RP#  
NC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
DQ12  
DQ4  
DQ12  
DQ4  
VCC  
VCC  
M5M29GB/T  
800ARV  
M5M29GB/T  
800AVP  
DQ11  
DQ3  
DQ11  
DQ3  
WP1#  
RY/BY#  
A18  
A17  
A7  
WP1#  
RY/BY#  
A18  
A17  
A7  
DQ10  
DQ2  
DQ10  
DQ2  
DQ9  
DQ9  
DQ1  
DQ1  
A6  
DQ8  
A6  
DQ8  
A5  
DQ0  
A5  
DQ0  
A4  
OE#  
GND  
CE#  
28  
27  
26  
25  
A4  
OE#  
GND  
CE#  
A0  
A3  
A3  
A2  
23  
24  
A2  
A1  
A0  
A1  
RV(Reverse bend): 48P3E-C  
Outline 48pin TSOP type-I (12 X 20mm)  
VP(Normal bend): 48P3E-B  
NC : NO CONNECTION  
June 1998 , Rev.3.1  
1

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