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M58LV064A150ZA1T PDF预览

M58LV064A150ZA1T

更新时间: 2024-01-23 14:50:52
品牌 Logo 应用领域
恒忆 - NUMONYX 内存集成电路
页数 文件大小 规格书
65页 376K
描述
Flash, 4MX16, 150ns, PBGA64, 10 X 13 MM, 1 MM PITCH, TBGA-64

M58LV064A150ZA1T 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:BGA包装说明:10 X 13 MM, 1 MM PITCH, TBGA-64
针数:64Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.52Is Samacsys:N
最长访问时间:150 ns其他特性:SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
命令用户界面:YES通用闪存接口:YES
数据轮询:NOJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:13 mm
内存密度:67108864 bit内存集成电路类型:FLASH
内存宽度:16功能数量:1
部门数/规模:64端子数量:64
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:TBGA
封装等效代码:BGA64,8X8,40封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE页面大小:4 words
并行/串行:PARALLEL电源:2/3.3,3.3 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:1M最大待机电流:0.000001 A
子类别:Flash Memories最大压摆率:0.05 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
切换位:NO类型:NOR TYPE
宽度:10 mmBase Number Matches:1

M58LV064A150ZA1T 数据手册

 浏览型号M58LV064A150ZA1T的Datasheet PDF文件第3页浏览型号M58LV064A150ZA1T的Datasheet PDF文件第4页浏览型号M58LV064A150ZA1T的Datasheet PDF文件第5页浏览型号M58LV064A150ZA1T的Datasheet PDF文件第7页浏览型号M58LV064A150ZA1T的Datasheet PDF文件第8页浏览型号M58LV064A150ZA1T的Datasheet PDF文件第9页 
M58LV064A, M58LV064B  
SUMMARY DESCRIPTION  
M58LV064 is a 64Mbit (4Mb x16 or 2Mb x32) non-  
volatile memory that can be read, erased and re-  
programmed. These operations can be performed  
using a single low voltage (2.7V to 3.6V) core sup-  
ply. On power-up the memory default to Read  
mode with an asynchronous bus where it can be  
read in the same way as a non-burst Flash mem-  
ory.  
The memory is divided into 64 blocks of 1Mbit that  
can be erased independently so it is possible to  
preserve valid data while old data is erased. Pro-  
gram and Erase commands are written to the  
Command Interface of the memory. An on-chip  
Program/Erase Controller simplifies the process of  
programming or erasing the memory by taking  
care of all of the special operations that are re-  
quired to update the memory contents. The end of  
a Program or Erase operation can be detected and  
any error conditions identified in the Status Regis-  
ter. The command set required to control the  
memory is consistent with JEDEC standards.  
The Write Buffer allows the microprocessor to pro-  
gram from 4 to 16 Words (or from 2 to 8 Double  
Words) in parallel, both speeding up the program-  
ming and freeing up the microprocessor to perform  
other work. The minimum buffer size for a program  
operation is a 4 Word (or 2 Double Word) page. A  
page can only be programmed once between  
Erase operations.  
Erase can be suspended in order to perform either  
Read or Program in any other block and then re-  
sumed. Program can be suspended to Read data  
in any other block and then resumed. Each block  
can be programmed and erased over 100,000 cy-  
cles.  
tion status of each block is restored to the state  
when power was last removed. Software com-  
mands are provided to allow protection of some or  
all of the blocks and to cancel all block protection  
bits simultaneously. All Program or Erase opera-  
tions are blocked when the Program Erase Enable  
input Vpp is low.  
The Reset/Power-Down pin is used to apply a  
Hardware Reset to the memory and to set the de-  
vice in deep power-down mode. It can also be  
used to temporarily disable the protection mecha-  
nism.  
In asynchronous mode Chip Enable, Output En-  
able and Write Enable signals control the bus op-  
eration of the memory. An Address Latch input can  
be used to latch addresses in Latch Controlled  
mode. Together they allow simple, yet powerful,  
connection to most microprocessors, often without  
additional logic.  
In synchronous mode all Bus Read operations are  
synchronous with the Clock. Chip Enable and Out-  
put Enable select the Bus Read operation; the ad-  
dress is Latched using the Latch Enable inputs  
and the address is advanced using Burst Address  
Advance. The signals are compatible with most  
microprocessor burst interfaces.  
A One Time Programmable (OTP) area is included  
for security purposes. Either 1K Words (x16 Bus  
Width) or 1K Double-Words (x32 Bus Width) is  
available in the OTP area. The process of reading  
from and writing to the OTP area is not published  
for security purposes; contact STMicroelectronics  
for details on how to use the OTP area.  
The memory is offered in various packages. The  
M58LV064A is available in TSOP56 (14 x 20 mm)  
and TBGA64 (1mm pitch). The M58LV064B is  
available in TBGA80 (1mm pitch).  
Individual block protection against Program or  
Erase is provided for data security. All blocks are  
protected during power-up. The protection of the  
blocks is non-volatile; after power-up the protec-  
6/65  

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