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M36WT864B10ZA6T PDF预览

M36WT864B10ZA6T

更新时间: 2024-11-19 22:35:35
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存静态存储器
页数 文件大小 规格书
92页 622K
描述
64 Mbit 4Mb x16, Multiple Bank, Burst Flash Memory and 8 Mbit 512K x16 SRAM, Multiple Memory Product

M36WT864B10ZA6T 数据手册

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M36WT864TF  
M36WT864BF  
64 Mbit (4Mb x16, Multiple Bank, Burst) Flash Memory  
and 8 Mbit (512K x16) SRAM, Multiple Memory Product  
PRODUCT PREVIEW  
FEATURES SUMMARY  
SUPPLY VOLTAGE  
SRAM  
8 Mbit (512K x 16 bit)  
EQUAL CYCLE and ACCESS TIMES: 70ns  
– V  
– V  
– V  
= 1.65V to 2.2V  
DDF  
DDS  
PPF  
= V  
= 2.7V to 3.3V  
DDQF  
LOW STANDBY CURRENT  
= 12V for Fast Program (optional)  
LOW V  
DATA RETENTION: 1.5V  
DDS  
ACCESS TIME: 70, 85, 100ns  
LOW POWER CONSUMPTION  
ELECTRONIC SIGNATURE  
TRI-STATE COMMON I/O  
AUTOMATIC POWER DOWN  
– Manufacturer Code: 20h  
Figure 1. Packages  
– Top Device Code, M36WT864TF: 8810h  
– Bottom Device Code, M36WT864BF: 8811h  
FLASH MEMORY  
PROGRAMMING TIME  
– 8µs by Word typical for Fast Factory Program  
– Double/Quadruple Word Program option  
– Enhanced Factory Program options  
MEMORY BLOCKS  
FBGA  
– Multiple Bank Memory Array: 4 Mbit Banks  
– Parameter Blocks (Top or Bottom location)  
DUAL OPERATIONS  
Stacked LFBGA96 (ZA)  
8 x 14mm  
– Program Erase in one Bank while Read in  
others  
– No delay between Read and Write operations  
BLOCK LOCKING  
– All blocks locked at Power up  
– Any combination of blocks can be locked  
– WP for Block Lock-Down  
SECURITY  
– 128 bit user programmable OTP cells  
– 64 bit unique device number  
– One parameter block permanently lockable  
COMMON FLASH INTERFACE (CFI)  
100,000 PROGRAM/ERASE CYCLES per  
BLOCK  
July 2002  
1/92  
This is preliminary information on a new product now in development. Details are subject to change without notice.  

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