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M28.173A PDF预览

M28.173A

更新时间: 2024-10-30 22:11:19
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英特矽尔 - INTERSIL /
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1页 17K
描述
Plastic Packages for Integrated Circuits

M28.173A 数据手册

  
Plastic Packages for Integrated Circuits  
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)  
M28.173A  
N
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC  
INDEX  
AREA  
0.25(0.010)  
M
B M  
E
PACKAGE  
E1  
-B-  
INCHES  
MIN  
MILLIMETERS  
GAUGE  
PLANE  
SYMBOL  
MAX  
0.047  
0.006  
0.051  
0.0118  
0.0079  
0.386  
0.177  
MIN  
-
MAX  
1.20  
0.15  
1.05  
0.30  
0.20  
9.80  
4.50  
NOTES  
A
A1  
A2  
b
-
-
1
2
3
0.002  
0.031  
0.0075  
0.0035  
0.378  
0.169  
0.05  
0.80  
0.19  
0.09  
9.60  
4.30  
-
L
TOP VIEW  
-
0.25  
0.010  
9
0.05(0.002)  
SEATING PLANE  
A
c
-
-A-  
D
D
3
E1  
e
4
α
-C-  
A2  
0.026 BSC  
0.65 BSC  
-
c
e
A1  
E
0.246  
0.256  
6.25  
0.45  
6.50  
0.75  
-
b
L
0.0177  
0.0295  
6
0.10(0.004)  
N
28  
28  
7
0.10(0.004) M  
C A M B S  
o
o
o
o
0
8
0
8
-
11  
α
P
-
-
0.138  
0.118  
-
-
3.50  
3.0  
1
2
3
P1  
11  
NOTES:  
Rev. 1 6/99  
P1  
1. These package dimensions are within allowable dimensions  
of JEDEC MO-153-AET, Issue E.  
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.  
N
3. Dimension “D” does not include mold flash, protrusions or  
gate burrs. Mold flash, protrusion and gate burrs shall not  
exceed 0.15mm (0.006 inch) per side.  
P
BOTTOM VIEW  
4. Dimension “E1” does not include interlead flash or protru-  
sions. Interlead flash and protrusions shall not exceed  
0.15mm (0.006 inch) per side.  
5. The chamfer on the body is optional. If it is not present, a vi-  
sual index feature must be located within the crosshatched  
area.  
6. “L” is the length of terminal for soldering to a substrate.  
7. “N” is the number of terminal positions.  
8. Terminal numbers are shown for reference only.  
9. Dimension “b” does not include dambar protrusion. Allow-  
able dambar protrusion shall be 0.08mm (0.003 inch) total  
in excess of “b” dimension at maximum material condition.  
Minimum space between protrusion and adjacent lead is  
0.07mm (0.0027 inch).  
10. Controlling dimension: MILLIMETER. Converted inch di-  
mensions are not necessarily exact. (Angles in degrees)  
11. Dimensions “P” and “P1” are thermal and/or electrical en-  
hanced variations. Values shown are maximum size of ex-  
posed pad within lead count and body size.  
52  

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