LMV831, LMV832, LMV834
SNOSAZ6B –AUGUST 2008–REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Human Body Model
Charge-Device Model
Machine Model
2 kV
ESD Tolerance(3)
1 kV
200V
VIN Differential
Supply Voltage (VS = V+ – V−)
± Supply Voltage
6V
V++0.4V,
Voltage at Input/Output Pins
V− −0.4V
Storage Temperature Range
Junction Temperature(4)
Soldering Information
−65°C to 150°C
150°C
Infrared or Convection (20 sec)
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
Operating Ratings(1)
Temperature Range(2)
Supply Voltage (VS = V+ – V−)
−40°C to 125°C
2.7V to 5.5V
302°C/W
5-Pin SC70
(2)
Package Thermal Resistance (θJA
)
8-Pin VSSOP
14-Pin TSSOP
217°C/W
135°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
3.3V Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for at TA = 25°C, V+ = 3.3V, V− = 0V, VCM = V+/2, and RL =10 kΩ to V+/2.
Boldface limits apply at the temperature extremes.
Symbol
VOS
TCVOS
Parameter
Conditions
Min
Typ
Max
Units
(2)
(3)
(2)
Input Offset Voltage(4)
±0.25
±0.5
±0.5
±1.00
±1.23
mV
Input Offset Voltage Temperature
Drift(4)(5)
LMV831,
LMV832
±1.5
μV/°C
LMV834
±1.7
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ > TA.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(4) The typical value is calculated by applying absolute value transform to the distribution, then taking the statistical average of the resulting
distribution.
(5) This parameter is specified by design and/or characterization and is not tested in production.
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