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LA-B4 PDF预览

LA-B4

更新时间: 2024-09-20 03:50:11
品牌 Logo 应用领域
西迪斯 - CTS 半导体
页数 文件大小 规格书
2页 301K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

LA-B4 数据手册

 浏览型号LA-B4的Datasheet PDF文件第2页 
Series LA-B4  
Technical  
METAL CASE, CASE-MOUNTED  
SEMICONDUCTORS  
Part Number Series LA-B4  
Natural Conv. (°C/W): 10.3  
Forced Air (°C/W): 3.2  
Mounting Envelope: 1.63" x 1.29" x 1.00"  
DESCRIPTION OF CURVES  
A.  
B.  
N.C. Horiz. Device Only  
Mounted to G-10.  
N.C Horiz. & Vert. With  
Dissipator.  
C.  
D.  
E.  
200 FPM w/Diss.  
500 FPM w/Diss.  
1000 FPM w/Diss.  
Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.  
Derate 0.7 °C/watt for unplated part in natural convection only.  

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