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KBA0401A0M-T401 PDF预览

KBA0401A0M-T401

更新时间: 2024-01-09 20:59:59
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
48页 1039K
描述
Memory Circuit, Flash+PSRAM+SRAM, 4MX16, CMOS, PBGA80, 11 X 10 MM, TBGA-80

KBA0401A0M-T401 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA, BGA80,9X12,32针数:80
Reach Compliance Code:compliantHTS代码:8542.32.00.71
风险等级:5.84最长访问时间:85 ns
其他特性:ALSO CONTAINS 2M X 16 UTRAM AND 512K X 16 SRAMJESD-30 代码:R-PBGA-B80
长度:11 mm内存密度:67108864 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
混合内存类型:FLASH+PSRAM+SRAM功能数量:1
端子数量:80字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:4MX16封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA80,9X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
电源:3 V认证状态:Not Qualified
座面最大高度:1.4 mm最大待机电流:0.000006 A
子类别:Other Memory ICs最大压摆率:0.035 mA
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:10 mm
Base Number Matches:1

KBA0401A0M-T401 数据手册

 浏览型号KBA0401A0M-T401的Datasheet PDF文件第42页浏览型号KBA0401A0M-T401的Datasheet PDF文件第43页浏览型号KBA0401A0M-T401的Datasheet PDF文件第44页浏览型号KBA0401A0M-T401的Datasheet PDF文件第45页浏览型号KBA0401A0M-T401的Datasheet PDF文件第46页浏览型号KBA0401A0M-T401的Datasheet PDF文件第48页 
TNAL0101  
UtRAM USAGE AND TIMING  
TECHNICAL  
NOTE  
UtRAM USAGE AND TIMING  
INTRODUCTION  
DESIGN ACHIEVES SRAM SPECIFIC  
OPERATIONS  
The UtRAM was designed to work just like an SRAM - without  
any waits or other overhead for precharging or refreshing its  
internal DRAM cells. SAMSUNG Electronics(SAMSUNG) hides  
these operations inside with advanced design technology -  
those are not to be seen from outside. Precharging takes place  
during every access, overlapped between the end of the cycle  
and the decoding portion of the next cycle.  
Hiding refresh is more difficult. Every row in every block must  
be refreshed at least once during the refresh interval to prevent  
data loss. SAMSUNG provides an internal refresh controller for  
devices. When all accesses within refresh interval are directed  
to one macro-cell, as can happen in signal processing applica-  
tions, a more sophisticated approach is required to hide  
refresh. The pseudo SRAM is sometimes used on these appli-  
cations, which requires a memory controller that can hold off  
accesses when a refresh operation is needed. SAMSUNGs’  
unique qualitative advantage over these parts(in addition to  
quantitative improvements in access speed and power con-  
sumption) is that the UtRAM never need to hold off accesses,  
and indeed it has no hold off signal. The circuitry that gives  
SAMSUNG this advantage is fairly simple but has not previ-  
ously been disclosed.  
UtRAM is based on single-transistor DRAM cells. As with any  
other DRAM, the data in these cells must be periodically  
refreshed to prevent data loss. What makes the UtRAM unique  
is that it offers a true SRAM style interface that hides all refresh  
operations from the memory controller.  
START WITH A DRAM TECHNOLOGY  
The key point of UtRAM is its high speed and low power. This  
high speed comes from the use of many small blocks such as  
32Kbits each to create UtRAM arrays. The small blocks have  
short word lines thus with little capacitance eliminating a major  
factor of operating current dissipation in conventional DRAM  
blocks.  
Each independent macro-cell on a UtRAM device consists of a  
number of these blocks. Each chip has one or more macro.  
The address decoding logic is also fast. UtRAM performs a  
complete read operation in every tRC, but UtRAM needs power  
up sequence like DRAM.  
Power Up Sequence and Diagram  
1. Apply power.  
2. Maintain stable power for a minium 200ms with CS=high.  
3. Issue read operation at least 2 times.  
AVOID TIMING  
CS=VIL, UB or/and LB=VIL  
ZZ=VIH  
CS=VIH  
Following figures show you an abnormal timing which is not  
supported on UtRAM and its solution.  
Initial State  
(Wait 200ms)  
Power On  
Active  
If your system has a timing which sustains invalid states over  
4ms at read mode like Figure 1, there are some guide lines for  
proper operation of UtRAM.  
Read Operation(2 times)  
When your system has multiple invalid address signals shorter  
than tRC on the timing shown in Figure 1, UtRAM needs a nor-  
mal read timing(tRC) during that cycle(Figure 2) or needs to  
toggle CS once to h’ igh’for about t’RC(’Figure 3).  
Figure 1.  
Over 4ms  
CS  
WE  
Less than tRC  
Address  
Put on read operation every 4ms  
Figure 2.  
Over 4ms  
CS  
WE  
tRC  
Address  
SRAM PRODUCT PLANNING  
SAMSUNG Electronics CO., LTD. reserves the right to change products or specifications without notice.  
LIM-011025  
Ó2002 SAMSUNG Electronics CO., LTD.  
- 47 -  

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