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KBC00B7A0M-D405 PDF预览

KBC00B7A0M-D405

更新时间: 2024-11-22 09:05:31
品牌 Logo 应用领域
三星 - SAMSUNG 静态存储器内存集成电路
页数 文件大小 规格书
46页 692K
描述
Memory Circuit, Flash+PSRAM+SRAM, Hybrid, PBGA111

KBC00B7A0M-D405 技术参数

生命周期:Obsolete包装说明:FBGA, BGA111,12X13,32
Reach Compliance Code:compliant风险等级:5.84
最长访问时间:70 nsJESD-30 代码:R-PBGA-B111
内存集成电路类型:MEMORY CIRCUIT混合内存类型:FLASH+PSRAM+SRAM
端子数量:111最高工作温度:85 °C
最低工作温度:-25 °C封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA111,12X13,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
电源:3/3.3 V认证状态:Not Qualified
最大待机电流:0.000015 A子类别:Other Memory ICs
最大压摆率:0.045 mA表面贴装:YES
技术:HYBRID温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOMBase Number Matches:1

KBC00B7A0M-D405 数据手册

 浏览型号KBC00B7A0M-D405的Datasheet PDF文件第2页浏览型号KBC00B7A0M-D405的Datasheet PDF文件第3页浏览型号KBC00B7A0M-D405的Datasheet PDF文件第4页浏览型号KBC00B7A0M-D405的Datasheet PDF文件第5页浏览型号KBC00B7A0M-D405的Datasheet PDF文件第6页浏览型号KBC00B7A0M-D405的Datasheet PDF文件第7页 
Preliminary  
MCP MEMORY  
KBC00B7A0M  
Document Title  
Multi-Chip Package MEMORY  
256M Bit (16Mx16) Nand Flash Memory / 64M Bit (4Mx16) UtRAM / 64M Bit (4Mx16) UtRAM / 8M Bit (512Kx16) SRAM  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial draft.  
May 19, 2003  
Preliminary  
0.1  
Revised(SRAM)  
June 27, 2003  
Preliminary  
- Changed Speed Bins from 70ns to 55ns.  
- Added ISB1(Typ) 5.0mA in DC AND OPERATING CHARACTERISTIC.  
- Changed Output load from CL=100pF+1TTL to CL=30pF+1TTL in AC  
OPERATING CONDITIONS.  
- Added IDR(Typ) 1.0mA in DATA RETENTION CHARACTERISTICS.  
- Changed ball name from Vccqs to Vccs in Pin Configuration.  
0.11  
1.0  
Revised  
- Added Package D :FBGA(L/F)  
July 11, 2003  
Preliminary  
Finalized  
September 25, 2003 Final  
<UtRAM>  
- Changed tPC from Max 25ns to Min 25ns in the AC Characteristics.  
<NAND>  
- Corrected the FLASH READ1 OPERATION(READ ONE PAGE) timing  
in Page 19.  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site.  
http://samsungelectronics.com/semiconductors/products/products_index.html  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
Revision 1.0  
September 2003  
- 1 -  

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