Datasheet > KBC00B7A0M-F405

KBC00B7A0M-F405

更新时间： 2024-01-07 13:33:04

品牌	Logo	应用领域
三星 - SAMSUNG		静态存储器内存集成电路
页数	文件大小	规格书
46页	692K
描述
Memory Circuit, Flash+PSRAM+SRAM, Hybrid, PBGA111

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技术参数
数据手册

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KBC00B7A0M-F405 技术参数

生命周期：	Obsolete	包装说明：	FBGA, BGA111,12X13,32
Reach Compliance Code：	compliant	风险等级：	5.84
最长访问时间：	70 ns	JESD-30 代码：	R-PBGA-B111
内存集成电路类型：	MEMORY CIRCUIT	混合内存类型：	FLASH+PSRAM+SRAM
端子数量：	111	最高工作温度：	85 °C
最低工作温度：	-25 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	FBGA	封装等效代码：	BGA111,12X13,32
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, FINE PITCH
电源：	3/3.3 V	认证状态：	Not Qualified
最大待机电流：	0.000015 A	子类别：	Other Memory ICs
最大压摆率：	0.045 mA	表面贴装：	YES
技术：	HYBRID	温度等级：	OTHER
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	Base Number Matches：	1

KBC00B7A0M-F405 数据手册

Preliminary

MCP MEMORY

KBC00B7A0M

Document Title

Multi-Chip Package MEMORY

256M Bit (16Mx16) Nand Flash Memory / 64M Bit (4Mx16) UtRAM / 64M Bit (4Mx16) UtRAM / 8M Bit (512Kx16) SRAM

Revision History

Revision No. History

Draft Date

Remark

0.0

Initial draft.

May 19, 2003

Preliminary

0.1

Revised(SRAM)

June 27, 2003

Preliminary

- Changed Speed Bins from 70ns to 55ns.

- Added ISB1(Typ) 5.0mA in DC AND OPERATING CHARACTERISTIC.

- Changed Output load from CL=100pF+1TTL to CL=30pF+1TTL in AC

OPERATING CONDITIONS.

- Added IDR(Typ) 1.0mA in DATA RETENTION CHARACTERISTICS.

- Changed ball name from Vccqs to Vccs in Pin Configuration.

0.11

1.0

Revised

- Added Package D :FBGA(L/F)

July 11, 2003

Preliminary

Finalized

September 25, 2003 Final

<UtRAM>

- Changed tPC from Max 25ns to Min 25ns in the AC Characteristics.

<NAND>

- Corrected the FLASH READ1 OPERATION(READ ONE PAGE) timing

in Page 19.

Note : For more detailed features and specifications including FAQ, please refer to Samsung’s web site.

http://samsungelectronics.com/semiconductors/products/products_index.html

The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right

to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have

any questions, please contact the SAMSUNG branch office near you.

Revision 1.0

September 2003

- 1 -

12 3 4 5 6 7...46

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