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K9K1208U0C-GIB0T PDF预览

K9K1208U0C-GIB0T

更新时间: 2024-11-30 08:59:15
品牌 Logo 应用领域
三星 - SAMSUNG 可编程只读存储器电动程控只读存储器电可擦编程只读存储器内存集成电路
页数 文件大小 规格书
39页 955K
描述
IC,EEPROM,NAND FLASH,64MX8,CMOS,BGA,63PIN,PLASTIC

K9K1208U0C-GIB0T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete包装说明:FBGA, BGA63,10X12,32
Reach Compliance Code:compliant风险等级:5.68
最长访问时间:30 ns命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PBGA-B63
内存密度:536870912 bit内存集成电路类型:FLASH
内存宽度:8湿度敏感等级:1
部门数/规模:4K端子数量:63
字数:67108864 words字数代码:64000000
最高工作温度:85 °C最低工作温度:-40 °C
组织:64MX8封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA63,10X12,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, FINE PITCH
页面大小:512 words并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:3.3 V
认证状态:Not Qualified就绪/忙碌:YES
部门规模:16K最大待机电流:0.00005 A
子类别:Flash Memories最大压摆率:0.04 mA
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
切换位:NO

K9K1208U0C-GIB0T 数据手册

 浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第2页浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第3页浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第4页浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第5页浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第6页浏览型号K9K1208U0C-GIB0T的Datasheet PDF文件第7页 
K9K1208Q0C  
K9K1208D0C  
K9K1208U0C  
K9K1216Q0C  
K9K1216D0C  
K9K1216U0C  
FLASH MEMORY  
Document Title  
64M x 8 Bit , 32M x 16 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
Initial issue.  
Sep. 12th 2002  
Advance  
1.0  
1.Pin assignment of TBGA dummy ball is changed.  
(before) DNU --> (after) N.C  
Jan. 3rd 2003  
2. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 34)  
3. Add the data protection Vcc guidence for 1.8V device - below about  
1.1V. (Page 35)  
4. Add the specification of Block Lock scheme.(Page 29~32)  
5. Pin assignment of TBGA A3 ball is changed.  
(before) N.C --> (after) Vss  
2.0  
1. The Maximum operating current is changed.  
Read : Icc1 20mA-->30mA  
Program : Icc2 20mA-->40mA  
Erase : Icc3 20mA-->40mA  
Jan. 17th 2003  
Preliminary  
Preliminary  
2.1  
2.2  
The min. Vcc value 1.8V devices is changed.  
K9K12XXQ0C : Vcc 1.65V~1.95V --> 1.70V~1.95V  
Mar. 5th 2003  
Pb-free Package is added.  
K9K1208U0C-HCB0,HIB0  
K9K12XXQ0C-HCB0,HIB0  
K9K1216U0C-HCB0,HIB0  
K9K1216Q0C-HCB0,HIB0  
Mar. 13rd 2003  
2.3  
2.4  
Errata is added.(Front Page)-K9K12XXQ0C  
tWC tWP tRC tREH tRP tREA tCEA  
Mar. 17th 2003  
Apr. 4th 2003  
Specification  
45 25 50 15 25 30  
45  
55  
Relaxed value 60 40 60 20 40 40  
1. Max. Thickness of TBGA packge is changed.  
0.09±0.10(Before) --> 1.10±0.10(After)  
2. New definition of the number of invalid blocks is added.  
(Minimum 1004 valid blocks are guaranteed for each contiguous 128Mb  
memory space.)  
1. The guidence of LOCKPRE pin usage is changed.  
Don’t leave it N.C. Not using LOCK MECHANISM & POWER-ON AUTO-  
READ, connect it Vss.(Before)  
2.5  
Jul. 4th 2003  
--> Not using LOCK MECHANISM & POWER-ON AUTO-READ, connect  
it Vss or leave it N.C(After)  
2. 2.65V device is added.  
3. Note is added.  
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for  
durations of 20 ns or less.)  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right  
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have  
any questions, please contact the SAMSUNG branch office near you.  
1

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