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K9F6408U0B

更新时间: 2024-01-15 23:11:18
品牌 Logo 应用领域
三星 - SAMSUNG 闪存
页数 文件大小 规格书
27页 414K
描述
8M x 8 Bit NAND Flash Memory

K9F6408U0B 数据手册

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K9F6408U0B-TCB0, K9F6408U0B-TIB0  
FLASH MEMORY  
Document Title  
8M x 8 Bit NAND Flash Memory  
Revision History  
Revision No. History  
Draft Date  
Remark  
0.0  
0.1  
Initial issue.  
July 17th 2000  
Preliminary  
1. Changed endurance : 1 million -> 100K program/erase cycles  
1. Changed don’t care mode in address cycles  
Nov. 20th 2000  
- *X can be "High" or "Low" => *L must be set to "Low"  
2. Explain how pointer operation works in detail.  
3. Renamed GND input (pin # 6) on behalf of SE (pin # 6)  
- The SE input controls the access of the spare area. When SE is high,  
the spare area is not accessible for reading or programming. SE is rec  
ommended to be coupled to GND or Vcc and should not be toggled  
during reading or programming.  
=> Connect this input pin to GND or set to static low state unless the  
sequential read mode excluding spare area is used.  
4. Updated operation for tRST timing  
- If reset command(FFh) is written at Ready state, the device goes into  
Busy for maximum 5us.  
0.2  
1.Powerup sequence is added  
: Recovery time of minimum 1ms is required before internal circuit gets  
ready for any command sequences  
Jul. 25th. 2001  
~ 2.5V  
~ 2.5V  
V
CC  
High  
WP  
WE  
1m  
2. AC parameter tCLR(CLE to RE Delay, min 50ns) is added.  
3. AC parameter tAR1 value : 100ns --> 20ns  
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.  
http://www.intl.samsungsemi.com/Memory/Flash/datasheets.html  
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the  
SAMSUNG branch office near you.  
1

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