生命周期: | Obsolete | 零件包装代码: | TSOP1 |
包装说明: | 20 X 12 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | 针数: | 48 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.B.1.A |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.83 |
最长访问时间: | 45 ns | JESD-30 代码: | R-PDSO-G48 |
长度: | 20 mm | 内存密度: | 268435456 bit |
内存集成电路类型: | FLASH | 内存宽度: | 8 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 33554432 words | 字数代码: | 32000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 32MX8 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | PARALLEL | 编程电压: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.35 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 类型: | NAND TYPE |
宽度: | 12 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K9F5608U0D-PIB0 | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608U0DPIB000 | SAMSUNG |
获取价格 |
Flash, 32MX8, 45ns, PDSO48, 20 X 12 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9F5608U0D-PIB0T | SAMSUNG |
获取价格 |
Flash, 32MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | |
K9F5608U0D-XCB0 | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608U0D-XIB0 | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608U0M- | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608U0M-YCB0 | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608U0M-YIB0 | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory | |
K9F5608UOC | SAMSUNG |
获取价格 |
32M x 8 Bit 16M x 16 Bit NAND Flash Memory | |
K9F5608X0D | SAMSUNG |
获取价格 |
32M x 8 Bit NAND Flash Memory |