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K7I320882M-FC25 PDF预览

K7I320882M-FC25

更新时间: 2024-11-25 07:18:59
品牌 Logo 应用领域
三星 - SAMSUNG 双倍数据速率静态存储器
页数 文件大小 规格书
18页 181K
描述
DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165

K7I320882M-FC25 数据手册

 浏览型号K7I320882M-FC25的Datasheet PDF文件第2页浏览型号K7I320882M-FC25的Datasheet PDF文件第3页浏览型号K7I320882M-FC25的Datasheet PDF文件第4页浏览型号K7I320882M-FC25的Datasheet PDF文件第5页浏览型号K7I320882M-FC25的Datasheet PDF文件第6页浏览型号K7I320882M-FC25的Datasheet PDF文件第7页 
K7I323682M  
K7I321882M  
K7I320882M  
Preliminary  
1Mx36 & 2Mx18 & 4Mx8 DDRII CIO b2 SRAM  
Document Title  
1Mx36-bit, 2Mx18-bit, 4Mx8-bit DDRII CIO b2 SRAM  
Revision History  
Rev. No.  
History  
Draft Date  
Remark  
0.0  
1. Initial document.  
Advance  
Preliminary  
October, 22 2001  
December, 12 2001  
0.1  
1. Pin name change from DLL to Doff.  
2. Vddq range change from 1.5V to 1.5V~1.8V.  
3. Update JTAG test conditions.  
4. Reserved pin for high density name change from NC to Vss/SA  
5. Delete AC test condition about Clock Input timing Reference Level  
6. Delete clock description on page 2 and add HSTL I/O comment  
0.2  
0.3  
0.4  
1. Update current characteristics in DC electrical characteristics  
2. Change AC timing characteristics  
Preliminary  
Preliminary  
Preliminary  
July, 29. 2002  
Sep. 6. 2002  
Oct. 7. 2002  
3. Update JTAG instruction coding and diagrams  
1. Add AC electrical characteristics.  
2. Change AC timing characteristics.  
3. Change DC electrical characteristics(ISB1)  
1. Change the data Setup/Hold time.  
2. Change the Access Time.(tCHQV, tCHQX, etc.)  
3. Change the Clock Cycle Time.(MAX value of tKHKH)  
4. Change the JTAG instruction coding.  
0.5  
1. Change the Boundary scan exit order.  
Preliminary  
Dec. 16, 2002  
2. Change the AC timing characteristics(-25, -20)  
3. Correct the Overshoot and Undershoot timing diagrams.  
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the  
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-  
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.  
Dec. 2002  
Rev 0.5  
- 1 -  

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DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
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Application Specific SRAM, 4MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
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DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
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DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
K7I320884M-FC20T SAMSUNG

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Application Specific SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
K7I320884M-FC25 SAMSUNG

获取价格

DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
K7I320884M-FC250 SAMSUNG

获取价格

DDR SRAM, 4MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165