是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 包装说明: | BGA, BGA165,11X15,40 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
最长访问时间: | 0.45 ns | 最大时钟频率 (fCLK): | 166 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PBGA-B165 |
JESD-609代码: | e1 | 内存密度: | 18874368 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 36 |
湿度敏感等级: | 3 | 端子数量: | 165 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | SYNCHRONOUS | 组织: | 512KX36 |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA165,11X15,40 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
电源: | 1.5/1.8,1.8 V | 认证状态: | Not Qualified |
最大待机电流: | 0.17 A | 最小待机电流: | 1.7 V |
子类别: | SRAMs | 最大压摆率: | 0.45 mA |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K7I163682B-EI20T | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 0.45ns, CMOS, PBGA165 | |
K7I163682B-EI250 | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | |
K7I163682B-EI25T | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 0.45ns, CMOS, PBGA165 | |
K7I163682B-EI30T | SAMSUNG |
获取价格 |
Standard SRAM, 512KX36, 0.45ns, CMOS, PBGA165 | |
K7I163682B-FC16 | SAMSUNG |
获取价格 |
512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM | |
K7I163682B-FC160 | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
K7I163682B-FC16T | SAMSUNG |
获取价格 |
暂无描述 | |
K7I163682B-FC20 | SAMSUNG |
获取价格 |
512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM | |
K7I163682B-FC20T | SAMSUNG |
获取价格 |
DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
K7I163682B-FC25 | SAMSUNG |
获取价格 |
512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM |