是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 153 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.84 | JESD-30 代码: | R-PBGA-B153 |
JESD-609代码: | e1 | 长度: | 22 mm |
内存密度: | 37748736 bit | 内存集成电路类型: | DDR SRAM |
内存宽度: | 36 | 湿度敏感等级: | 2 |
功能数量: | 1 | 端子数量: | 153 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 1MX36 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 2.21 mm |
最大供电电压 (Vsup): | 2.6 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K7D323674A-GC37 | SAMSUNG |
获取价格 |
Standard SRAM, 1MX36, 2ns, CMOS, PBGA153 | |
K7D323674A-GC370 | SAMSUNG |
获取价格 |
DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, BGA-153 | |
K7D323674A-GC40 | SAMSUNG |
获取价格 |
Standard SRAM, 1MX36, 2ns, CMOS, PBGA153 | |
K7D323674A-HC33 | SAMSUNG |
获取价格 |
32Mb A-die DDR SRAM Specification | |
K7D323674A-HC37 | SAMSUNG |
获取价格 |
32Mb A-die DDR SRAM Specification | |
K7D323674A-HC370 | SAMSUNG |
获取价格 |
DDR SRAM, 1MX36, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D323674A-HC40 | SAMSUNG |
获取价格 |
32Mb A-die DDR SRAM Specification | |
K7D323674A-HC45 | SAMSUNG |
获取价格 |
DDR SRAM, 1MX36, 2.5ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D323674A-HC50 | SAMSUNG |
获取价格 |
DDR SRAM, 1MX36, 2.5ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | |
K7D323674A-HGC33 | SAMSUNG |
获取价格 |
32Mb A-die DDR SRAM Specification |