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K4M64163PK-BE900 PDF预览

K4M64163PK-BE900

更新时间: 2024-11-12 04:23:35
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
12页 115K
描述
Synchronous DRAM, 4MX16, 7ns, CMOS, PBGA54, LEAD FREE, FBGA-54

K4M64163PK-BE900 数据手册

 浏览型号K4M64163PK-BE900的Datasheet PDF文件第2页浏览型号K4M64163PK-BE900的Datasheet PDF文件第3页浏览型号K4M64163PK-BE900的Datasheet PDF文件第4页浏览型号K4M64163PK-BE900的Datasheet PDF文件第5页浏览型号K4M64163PK-BE900的Datasheet PDF文件第6页浏览型号K4M64163PK-BE900的Datasheet PDF文件第7页 
K4M64163PK - R(B)E/G/C/F  
Mobile-SDRAM  
1M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA  
FEATURES  
• 1.8V power supply.  
GENERAL DESCRIPTION  
The K4M64163PK is 67,108,864 bits synchronous high data  
rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits,  
fabricated with SAMSUNGs high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock, and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 54Balls FBGA ( -RXXX -Pb, -BXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M64163PK-R(B)E/G/C/F75  
K4M64163PK-R(B)E/G/C/F90  
K4M64163PK-R(B)E/G/C/F1L  
133MHz(CL3), 83MHz(CL2)  
111MHz(CL3), 83MHz(CL2)  
54 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1, 66MHz(CL2)  
- R(B)E/G : Normal / Low Power, Extended Temperature(-25°C ~ 85°C)  
- R(B)C/F : Normal / Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-  
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could  
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-  
visions may apply.  
1
October 2005  

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