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K4M64163PK-BF90 PDF预览

K4M64163PK-BF90

更新时间: 2024-09-25 02:59:55
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器
页数 文件大小 规格书
12页 115K
描述
1M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA

K4M64163PK-BF90 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FBGA, BGA54,9X9,32
Reach Compliance Code:compliant风险等级:5.84
最长访问时间:7 ns最大时钟频率 (fCLK):111 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54JESD-609代码:e3
内存密度:67108864 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16湿度敏感等级:1
端子数量:54字数:4194304 words
字数代码:4000000最高工作温度:70 °C
最低工作温度:-25 °C组织:4MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA54,9X9,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
峰值回流温度(摄氏度):225电源:1.8 V
认证状态:Not Qualified刷新周期:4096
连续突发长度:1,2,4,8,FP最大待机电流:0.0003 A
子类别:DRAMs最大压摆率:0.05 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:MATTE TIN端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED

K4M64163PK-BF90 数据手册

 浏览型号K4M64163PK-BF90的Datasheet PDF文件第2页浏览型号K4M64163PK-BF90的Datasheet PDF文件第3页浏览型号K4M64163PK-BF90的Datasheet PDF文件第4页浏览型号K4M64163PK-BF90的Datasheet PDF文件第5页浏览型号K4M64163PK-BF90的Datasheet PDF文件第6页浏览型号K4M64163PK-BF90的Datasheet PDF文件第7页 
K4M64163PK - R(B)E/G/C/F  
Mobile-SDRAM  
1M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA  
FEATURES  
• 1.8V power supply.  
GENERAL DESCRIPTION  
The K4M64163PK is 67,108,864 bits synchronous high data  
rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits,  
fabricated with SAMSUNGs high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock, and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 54Balls FBGA ( -RXXX -Pb, -BXXX -Pb Free).  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M64163PK-R(B)E/G/C/F75  
K4M64163PK-R(B)E/G/C/F90  
K4M64163PK-R(B)E/G/C/F1L  
133MHz(CL3), 83MHz(CL2)  
111MHz(CL3), 83MHz(CL2)  
54 FBGA Pb  
(Pb Free)  
LVCMOS  
111MHz(CL=3)*1, 66MHz(CL2)  
- R(B)E/G : Normal / Low Power, Extended Temperature(-25°C ~ 85°C)  
- R(B)C/F : Normal / Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-  
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could  
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-  
visions may apply.  
1
October 2005  

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