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K4M64163PH-RG1L PDF预览

K4M64163PH-RG1L

更新时间: 2024-11-11 20:53:35
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器内存集成电路
页数 文件大小 规格书
12页 114K
描述
Synchronous DRAM, 4MX16, 7ns, CMOS, PBGA54

K4M64163PH-RG1L 技术参数

是否Rohs认证: 不符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.79
最长访问时间:7 ns最大时钟频率 (fCLK):111 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54JESD-609代码:e0
内存密度:67108864 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16端子数量:54
字数:4194304 words字数代码:4000000
最高工作温度:85 °C最低工作温度:-25 °C
组织:4MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA54,9X9,32封装形状:SQUARE
封装形式:GRID ARRAY, FINE PITCH电源:1.8 V
认证状态:Not Qualified刷新周期:4096
连续突发长度:1,2,4,8,FP最大待机电流:0.0003 A
子类别:DRAMs最大压摆率:0.05 mA
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
Base Number Matches:1

K4M64163PH-RG1L 数据手册

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K4M64163PH - R(B)G/F  
Mobile-SDRAM  
1M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA  
FEATURES  
• 1.8V power supply.  
GENERAL DESCRIPTION  
The K4M64163PH is 67,108,864 bits synchronous high data  
rate Dynamic RAM organized as 4 x 1,048,576 words by 16 bits,  
fabricated with SAMSUNGs high performance CMOS technol-  
ogy. Synchronous design allows precise cycle control with the  
use of system clock, and I/O transactions are possible on every  
clock cycle. Range of operating frequencies, programmable  
burst lengths and programmable latencies allow the same  
device to be useful for a variety of high bandwidth and high per-  
formance memory system applications.  
• LVCMOS compatible with multiplexed address.  
• Four banks operation.  
• MRS cycle with address key programs.  
-. CAS latency (1, 2 & 3).  
-. Burst length (1, 2, 4, 8 & Full page).  
-. Burst type (Sequential & Interleave).  
• EMRS cycle with address key programs.  
• All inputs are sampled at the positive going edge of the system  
clock.  
• Burst read single-bit write operation.  
• Special Function Support.  
-. PASR (Partial Array Self Refresh).  
-. Internal TCSR (Temperature Compensated Self Refresh)  
-. DS (Driver Strength)  
• DQM for masking.  
• Auto refresh.  
• 64ms refresh period (4K cycle).  
• Commercial Temperature Operation (-25°C ~ 70°C).  
• Extended Temperature Operation (-25°C ~ 85°C).  
• 54Balls FBGA with 0.8mm ball pitch.  
( -RXXX : Leaded, -BXXX : Lead Free)  
ORDERING INFORMATION  
Part No.  
Max Freq.  
Interface  
Package  
K4M64163PH-R(B)G/F75  
K4M64163PH-R(B)G/F90  
K4M64163PH-R(B)G/F1L  
133MHz(CL=3), 83MHz(CL=2)  
111MHz(CL=3), 83MHz(CL=2)  
54 FBGA Leaded  
(Lead Free)  
LVCMOS  
111MHz(CL=3)*1, 66MHz(CL=2)  
- R(B)G : Low Power, Extended Temperature(-25°C ~ 85°C)  
- R(B)F : Low Power, Commercial Temperature(-25°C ~ 70°C)  
Notes :  
1. In case of 40MHz Frequency, CL1 can be supported.  
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.  
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific  
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.  
1
February 2004  

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