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K4H560838E-VLB30 PDF预览

K4H560838E-VLB30

更新时间: 2024-09-15 19:22:03
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
24页 364K
描述
DDR DRAM, 32MX8, 0.7ns, CMOS, PDSO54, 0.300 X 0.551 INCH, 0.50 MM PITCH, ROHS COMPLIANT, STSOP2-54

K4H560838E-VLB30 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSSOP,针数:54
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.67
访问模式:FOUR BANK PAGE BURST最长访问时间:0.7 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G54
长度:14 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:8
湿度敏感等级:2功能数量:1
端口数量:1端子数量:54
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:7.6 mmBase Number Matches:1

K4H560838E-VLB30 数据手册

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DDR SDRAM 256Mb E-die (x8)  
DDR SDRAM  
256Mb E-die DDR SDRAM Specification  
54 sTSOP-II(300mil x 551mil)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure could result in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.3 July. 2005  

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