是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | TSSOP, TSSOP66,.46 |
Reach Compliance Code: | compliant | 风险等级: | 5.92 |
Is Samacsys: | N | 最长访问时间: | 0.75 ns |
最大时钟频率 (fCLK): | 100 MHz | I/O 类型: | COMMON |
交错的突发长度: | 2,4,8 | JESD-30 代码: | R-PDSO-G66 |
JESD-609代码: | e0 | 内存密度: | 1073741824 bit |
内存集成电路类型: | DDR DRAM | 内存宽度: | 4 |
端子数量: | 66 | 字数: | 268435456 words |
字数代码: | 256000000 | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 256MX4 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TSSOP66,.46 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2.5 V |
认证状态: | Not Qualified | 刷新周期: | 8192 |
连续突发长度: | 2,4,8 | 最大待机电流: | 0.006 A |
子类别: | DRAMs | 最大压摆率: | 0.35 mA |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.635 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
K4H1G0438M-TCB00 | SAMSUNG |
获取价格 |
DDR DRAM, 256MX4, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4H1G0438M-TCB30 | SAMSUNG |
获取价格 |
DDR DRAM, 256MX4, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4H1G0438M-TCB3T | SAMSUNG |
获取价格 |
DDR DRAM, 256MX4, 0.7ns, CMOS, PDSO66 | |
K4H1G0438M-TLA0 | SAMSUNG |
获取价格 |
128Mb DDR SDRAM | |
K4H1G0438M-TLA2 | SAMSUNG |
获取价格 |
128Mb DDR SDRAM | |
K4H1G0438M-TLA20 | SAMSUNG |
获取价格 |
DDR DRAM, 256MX4, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4H1G0438M-TLA2T | SAMSUNG |
获取价格 |
暂无描述 | |
K4H1G0438M-TLB0 | SAMSUNG |
获取价格 |
128Mb DDR SDRAM | |
K4H1G0438M-TLB00 | SAMSUNG |
获取价格 |
DDR DRAM, 256MX4, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | |
K4H1G0438M-TLB0T | SAMSUNG |
获取价格 |
暂无描述 |