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K4F171611D-TL60 PDF预览

K4F171611D-TL60

更新时间: 2024-10-31 19:52:31
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
34页 381K
描述
Fast Page DRAM, 1MX16, 60ns, CMOS, PDSO44, 0.400 INCH, TSOP2-50/44

K4F171611D-TL60 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP44/50,.46,32
针数:50Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.92Is Samacsys:N
访问模式:FAST PAGE最长访问时间:60 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESHI/O 类型:COMMON
JESD-30 代码:R-PDSO-G44JESD-609代码:e0
长度:20.95 mm内存密度:16777216 bit
内存集成电路类型:FAST PAGE DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:44字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP44/50,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:YES最大待机电流:0.0002 A
子类别:DRAMs最大压摆率:0.08 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

K4F171611D-TL60 数据手册

 浏览型号K4F171611D-TL60的Datasheet PDF文件第2页浏览型号K4F171611D-TL60的Datasheet PDF文件第3页浏览型号K4F171611D-TL60的Datasheet PDF文件第4页浏览型号K4F171611D-TL60的Datasheet PDF文件第5页浏览型号K4F171611D-TL60的Datasheet PDF文件第6页浏览型号K4F171611D-TL60的Datasheet PDF文件第7页 
K4F171611D, K4F151611D  
K4F171612D, K4F151612D  
CMOS DRAM  
1M x 16Bit CMOS Dynamic RAM with Fast Page Mode  
DESCRIPTION  
This is a family of 1,048,576 x 16 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory  
cells within the same row. Power supply voltage (+5.0V or +3.3V), refresh cycle (1K Ref. or 4K Ref.), access time (-50 or -60), power  
consumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CAS-  
before-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is available in L-version. This  
1Mx16 Fast Page Mode DRAM family is fabricated using Samsung¢s advanced CMOS process to realize high band-width, low power  
consumption and high reliability. It may be used as graphic memory unit for microcomputer, personal computer and portable machines.  
FEATURES  
• Fast Page Mode operation  
• Part Identification  
• 2 CAS Byte/Word Read/Write operation  
• CAS-before-RAS refresh capability  
- K4F171611D-J(T) (5V, 4K Ref.)  
- K4F151611D-J(T) (5V, 1K Ref.)  
- K4F171612D-J(T) (3.3V, 4K Ref.)  
- K4F151612D-J(T) (3.3V, 1K Ref.)  
• RAS-only and Hidden refresh capability  
• Self-refresh capability (L-ver only)  
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs  
• Early Write or output enable controlled write  
• JEDEC Standard pinout  
Active Power Dissipation  
Unit : mW  
5V  
• Available in 42-pin SOJ 400mil and 50(44)-pin TSOP(II)  
3.3V  
400mil packages  
• Single +5V±10% power supply (5V product)  
Speed  
4K  
324  
288  
1K  
4K  
1K  
770  
715  
• Single +3.3V±0.3V power supply (3.3V product)  
-50  
-60  
504  
468  
495  
440  
FUNCTIONAL BLOCK DIAGRAM  
Refresh Cycles  
Part  
NO.  
Refresh  
cycle  
Refresh period  
Normal L-ver  
VCC  
RAS  
UCAS  
LCAS  
W
Vcc  
Vss  
Control  
Clocks  
VBB Generator  
K4F171611D  
5V  
4K  
1K  
64ms  
128ms  
16ms  
Lower  
K4F171612D 3.3V  
K4F151611D 5V  
Data in  
DQ0  
to  
Refresh Timer  
Refresh Control  
Row Decoder  
Buffer  
DQ7  
K4F151612D 3.3V  
Lower  
Data out  
Buffer  
Memory Array  
1,048,576 x16  
Cells  
OE  
Refresh Counter  
Row Address Buffer  
Col. Address Buffer  
Upper  
Data in  
Buffer  
Perfomance Range  
A0-A11  
(A0 - A9)*1  
A0 - A7  
DQ8  
to  
DQ15  
Speed  
-50  
Remark  
35ns 5V/3.3V  
tRAC  
50ns  
60ns  
tCAC  
tRC  
tPC  
Upper  
Data out  
Buffer  
15ns  
90ns  
Column Decoder  
(A0 - A9)*1  
-60  
15ns 110ns 40ns 5V/3.3V  
Note) *1 : 1K Refresh  
SAMSUNG ELECTRONICS CO., LTD. reserves the right to  
change products and specifications without notice.  

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暂无描述
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