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JANTXV2N6287 PDF预览

JANTXV2N6287

更新时间： 2024-02-02 10:44:32
品牌 Logo 应用领域
其他 - ETC 晶体晶体管开关局域网
页数 文件大小 规格书
14页 78K
描述
TRANSISTOR | BJT | DARLINGTON | PNP | 100V V(BR)CEO | 20A I(C) | TO-3

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JANTXV2N6287 技术参数

生命周期：Transferred包装说明：TO-3
Reach Compliance Code：compliantECCN代码：EAR99
风险等级：8.35最大集电极电流 (IC)：20 A
集电极-发射极最大电压：100 V配置：DARLINGTON
最小直流电流增益 (hFE)：150JEDEC-95代码：TO-204AA
JESD-30 代码：O-MBFM-P2元件数量：1
端子数量：2封装主体材料：METAL
封装形状：ROUND封装形式：FLANGE MOUNT
极性/信道类型：PNP认证状态：Qualified
参考标准：MIL-19500表面贴装：NO
端子形式：PIN/PEG端子位置：BOTTOM
晶体管应用：SWITCHING晶体管元件材料：SILICON
标称过渡频率 (fT)：4 MHzBase Number Matches：1

JANTXV2N6287 数据手册

 浏览型号JANTXV2N6287的Datasheet PDF文件第1页浏览型号JANTXV2N6287的Datasheet PDF文件第3页浏览型号JANTXV2N6287的Datasheet PDF文件第4页浏览型号JANTXV2N6287的Datasheet PDF文件第5页浏览型号JANTXV2N6287的Datasheet PDF文件第6页浏览型号JANTXV2N6287的Datasheet PDF文件第7页 
MIL-PRF-19500/505B  
2. APPLICABLE DOCUMENTS  
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include  
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has  
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements  
documents cited in sections 3 and 4 of this specification, whether or not they are listed.  
2.2 Government documents.  
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document  
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department  
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).  
SPECIFICATION  
DEPARTMENT OF DEFENSE  
MIL-PRF-19500  
STANDARD  
- Semiconductor Devices, General Specification for.  
MILITARY  
MIL-STD-750  
- Test Methods for Semiconductor Devices.  
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Defense Automated  
Printing Service, Building 4D (DPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.)  
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for  
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,  
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing  
on the applicable qualified products list before contract award (see 4.2 and 6.3).  
3.2 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.  
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-  
19500.  
3.4 Interface requirements and physical dimensions. The interface requirements and physical dimensions shall be as specified in  
MIL-PRF-19500 and on figure 1 (similar to T0-3) herein.  
3.4.1 Lead finish. Unless otherwise specified, lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500, and  
herein.  
3.5 Marking. Devices shall be marked in accordance with MIL-PRF-19500.  
3.6 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in  
1.3, 1.4, and table I herein.  
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I.  
4. VERIFICATION  
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:  
a.  
b.  
c.  
Qualification inspection (see 4.2).  
Screening (see 4.3).  
Conformance inspection (see 4.4).  
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