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JANHCBF2N7382 PDF预览

JANHCBF2N7382

更新时间: 2024-11-03 14:42:55
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
15页 155K
描述
Transistor

JANHCBF2N7382 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:,Reach Compliance Code:unknown
风险等级:5.69配置:Single
最大漏极电流 (Abs) (ID):11 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):75 W
子类别:Other Transistors表面贴装:YES
Base Number Matches:1

JANHCBF2N7382 数据手册

 浏览型号JANHCBF2N7382的Datasheet PDF文件第2页浏览型号JANHCBF2N7382的Datasheet PDF文件第3页浏览型号JANHCBF2N7382的Datasheet PDF文件第4页浏览型号JANHCBF2N7382的Datasheet PDF文件第5页浏览型号JANHCBF2N7382的Datasheet PDF文件第6页浏览型号JANHCBF2N7382的Datasheet PDF文件第7页 
INCH-POUND  
The documentation and process conversion  
measures necessary to comply with this revision  
shall be completed by 26 April 2011.  
MIL-PRF-19500/657B  
26 January 2011  
SUPERSEDING  
MIL-PRF-19500/657A  
22 February 2000  
* PERFORMANCE SPECIFICATION SHEET  
SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE,  
N AND P-CHANNEL, SILICON  
VARIOUS TYPES JANHC AND JANKC  
This specification is approved for use by all Departments  
and Agencies of the Department of Defense.  
*
The requirements for acquiring the product described herein shall consist of  
this specification sheet and MIL-PRF-19500.  
1. SCOPE  
1.1 Scope. This specification covers the performance requirements for N and P-channel, enhancement-mode,  
MOSFET, radiation hardened, power transistor die. Two levels of product assurance are provided for each device  
type as specified in MIL-PRF-19500.  
* 1.2 Physical dimensions. See figures 1 through 8 herein.  
1.3 Maximum ratings. See the applicable performance specification sheet from table I herein.  
2. APPLICABLE DOCUMENTS  
* 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This  
section does not include documents cited in other sections of this specification or recommended for additional  
information or as examples. While every effort has been made to ensure the completeness of this list, document  
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this  
specification, whether or not they are listed.  
2.2 Government documents.  
* 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a  
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are  
those cited in the solicitation or contract.  
* DEPARTMENT OF DEFENSE SPECIFICATIONS  
MIL-PRF-19500  
* DEPARTMENT OF DEFENSE STANDARDS  
MIL-STD-750 Test Methods for Semiconductor Devices.  
-
Semiconductor Devices, General Specification for.  
-
* (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or  
https://assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,  
Philadelphia, PA 19111-5094.)  
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,  
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dscc.dla.mil. Since  
contact information can change, you may want to verify the currency of this address information using the  
ASSIST Online database at https://assist.daps.dla.mil/.  
AMSC N/A  
FSC 5961  

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