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IS62LV12816BLL-10TI PDF预览

IS62LV12816BLL-10TI

更新时间: 2024-01-31 02:38:57
品牌 Logo 应用领域
美国芯成 - ISSI 存储内存集成电路静态存储器光电二极管
页数 文件大小 规格书
10页 94K
描述
128K x 16 LOW VOLTAGE, ULTRA LOW POWER CMOS STATIC RAM

IS62LV12816BLL-10TI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2-44
针数:44Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.91最长访问时间:100 ns
I/O 类型:COMMONJESD-30 代码:R-PDSO-G44
JESD-609代码:e0长度:18.41 mm
内存密度:2097152 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:44字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP44,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5/3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.000005 A最小待机电流:2 V
子类别:SRAMs最大压摆率:0.025 mA
最大供电电压 (Vsup):3.45 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

IS62LV12816BLL-10TI 数据手册

 浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第4页浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第5页浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第6页浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第8页浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第9页浏览型号IS62LV12816BLL-10TI的Datasheet PDF文件第10页 
®
IS62LV12816BLL  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)  
ISSI  
-55  
-70  
-100  
Symbol  
tWC  
Parameter  
Min. Max.  
Min. Max.  
Min. Max.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Write Cycle Time  
55  
50  
50  
0
30  
70  
65  
65  
0
30  
100  
80  
80  
0
40  
1
tSCE  
tAW  
CE to Write End  
Address Setup Time to Write End  
Address Hold from Write End  
Address Setup Time  
tHA  
2
tSA  
0
0
0
tPWB  
tPWE  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width  
45  
45  
25  
0
60  
60  
30  
0
80  
80  
40  
0
3
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
tHD  
(3)  
tHZWE  
5
5
5
4
(3)  
tLZWE  
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.3V, input pulse levels of 0.4V to 2.2V  
and output loading specified in Figure 1.  
2. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states  
to initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced  
to the rising or falling edge of the signal that terminates the write.  
5
3. Tested with the load in Figure 2. Transition is measured 500 mV from steady-state voltage. Not 100ꢀ tested.  
6
AC WAVEFORMS  
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)  
7
t
WC  
VALID ADDRESS  
SCS  
ADDRESS  
8
t
SA  
t
t
HA  
CE  
t
AW  
9
t
tPPWWEE21  
WE  
t
PBW  
10  
11  
12  
UB, LB  
t
HZWE  
t
LZWE  
HIGH-Z  
DATA UNDEFINED  
DOUT  
t
SD  
t
HD  
DATAIN VALID  
DIN  
UB_CSWR1.eps  
Notes:  
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least one  
of the LB and UB inputs being in the LOW state.  
2. WRITE = (CE) [ (LB) = (UB) ] (WE).  
Integrated Silicon Solution, Inc. 1-800-379-4774  
7
Rev. B  
03/07/01  

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