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IS61QDB451236A-250M3L PDF预览

IS61QDB451236A-250M3L

更新时间: 2024-10-13 21:11:59
品牌 Logo 应用领域
美国芯成 - ISSI 时钟静态存储器内存集成电路
页数 文件大小 规格书
30页 585K
描述
QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165

IS61QDB451236A-250M3L 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:LBGA, BGA165,11X15,40针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41Factory Lead Time:10 weeks
风险等级:5.29最长访问时间:0.45 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):250 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PBGA-B165
JESD-609代码:e1长度:17 mm
内存密度:18874368 bit内存集成电路类型:QDR SRAM
内存宽度:36湿度敏感等级:3
功能数量:1端子数量:165
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:1.5/1.8,1.8 V认证状态:Not Qualified
座面最大高度:1.4 mm最大待机电流:0.27 A
最小待机电流:1.7 V子类别:SRAMs
最大压摆率:0.7 mA最大供电电压 (Vsup):1.89 V
最小供电电压 (Vsup):1.71 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:10
宽度:15 mmBase Number Matches:1

IS61QDB451236A-250M3L 数据手册

 浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第2页浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第3页浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第4页浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第5页浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第6页浏览型号IS61QDB451236A-250M3L的Datasheet PDF文件第7页 
IS61QDB41M18A  
IS61QDB451236A  
1Mx18, 512Kx36  
18Mb QUAD (Burst 4) SYNCHRONOUS SRAM  
OCTOBER 2014  
FEATURES  
DESCRIPTION  
The 18Mb IS61QDB451236A and IS61QDB41M18A are  
synchronous, high-performance CMOS static random access  
memory (SRAM) devices. These SRAMs have separate I/Os,  
eliminating the need for high-speed bus turnaround. The  
rising edge of K clock initiates the read/write operation, and  
all internal operations are self-timed. Refer to the Timing  
Reference Diagram for Truth Table for a description of the  
basic operations of these QUAD (Burst of 4) SRAMs.  
512Kx36 and 1Mx18 configuration available.  
On-chip Delay-Locked loop (DLL) for wide data valid  
window.  
Separate independent read and write ports with  
concurrent read and write operations.  
Synchronous pipeline read with late write operation.  
Double Data Rate (DDR) interface for read and  
write input ports.  
Read and write addresses are registered on alternating rising  
edges of the K clock. Reads and writes are performed in  
double data rate. The following are registered internally on  
the rising edge of the K clock:  
1.5 cycle read latency.  
Fixed 4-bit burst for read and write operations.  
Clock stop support.  
Two input clocks (K and K#) for address and control  
registering at rising edges only.  
Read/write address  
Read enable  
Two output clocks (C and C#) for data output control.  
Write enable  
Two echo clocks (CQ and CQ#) that are delivered  
simultaneously with data.  
Byte writes for burst addresses 1 and 3  
Data-in for burst addresses 1 and 3  
+1.8V core power supply and 1.5, 1.8V VDDQ, used  
with 0.75, 0.9V VREF.  
The following are registered on the rising edge of the K#  
clock:  
HSTL input and output interface.  
Byte writes for burst addresses 2 and 4  
Registered addresses, write and read controls, byte  
writes, data in, and data outputs.  
Data-in for burst addresses 2 and 4  
Full data coherency.  
Byte writes can change with the corresponding data-in to  
enable or disable writes on a per-byte basis. An internal write  
buffer enables the data-ins to be registered one cycle after  
the write address. The first data-in burst is clocked one cycle  
later than the write command signal, and the second burst is  
timed to the following rising edge of the K# clock. Two full  
clock cycles are required to complete a write operation.  
Boundary scan using limited set of JTAG 1149.1  
functions.  
Byte write capability.  
Fine ball grid array (FBGA) package:  
13mmx15mm and 15mmx17mm body size  
165-ball (11 x 15) array  
Programmable impedance output drivers via 5x  
user-supplied precision resistor.  
During the burst read operation, the data-outs from the first  
and third bursts are updated from output registers of the  
second and third rising edges of the C# clock (starting 1.5  
cycles later after read command). The data-outs from the  
second and fourth bursts are updated with the third and  
fourth rising edges of the C clock. The K and K# clocks are  
used to time the data-outs whenever the C and C# clocks are  
tied high. Two full clock cycles are required to complete a  
read operation.  
The device is operated with a single +1.8V power supply and  
is compatible with HSTL I/O interfaces.  
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can  
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such  
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc.- www.issi.com  
Rev. B  
1
10/02/2014  

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