IS61QDP2B22M18A/A1/A2
IS61QDP2B21M36A/A1/A2
2Mx18, 1Mx36
36Mb QUADP (Burst 2) Synchronous SRAM
(2.0 CYCLE READ LATENCY)
JANUARY 2015
DESCRIPTION
FEATURES
1Mx36 and 2Mx18 configuration available.
The
and
On-chip Delay-Locked Loop (DLL) for wide data
valid window.
are synchronous, high-
performance CMOS static random access memory (SRAM)
devices. These SRAMs have separate I/Os, eliminating the
need for high-speed bus turnaround. The rising edge of K
clock initiates the read/write operation, and all internal
operations are self-timed. Refer to the
Separate independent read and write ports with
concurrent read and write operations.
Synchronous pipeline read with EARLY write
operation.
for a description of the basic
Double Data Rate (DDR) interface for read and
write input ports.
operations of these
write addresses are registered on alternating rising edges of
the K clock. Read and write performed in double data rate.
SRAMs. Read and
2.0 Cycle read latency.
Fixed 2-bit burst for read and write operations.
Clock stop support.
The following are registered internally on the rising edge of
the K clock:
Two input clocks (K and K#) for address and control
registering at rising edges only.
Read address
Read enable
Two echo clocks (CQ and CQ#) that are delivered
simultaneously with data.
Write enable
Data-in for early writes
Data valid pin (QVLD).
+1.8V core power supply and 1.5, 1.8V VDDQ, used
with 0.75, 0.9V VREF.
The following are registered on the rising edge of the K#
clock:
HSTL input and output interface.
Write address
Registered addresses, write and read controls, byte
writes, data in, and data outputs.
Byte writes
Data-in for second burst addresses
Full data coherency.
Boundary scan using limited set of JTAG 1149.1
functions.
Byte writes can change with the corresponding data-in to
enable or disable writes on a per-byte basis. An internal write
buffer enables the data-ins to be registered half a cycle
earlier than the write address. The first data-in burst is
clocked at the same time as the write command signal, and
the second burst is timed to the following rising edge of the
K# clock.
Byte Write capability.
Fine ball grid array (FBGA) package option:
13mmx15mm and 15mmx17mm body size
165-ball (11 x 15) array
Programmable impedance output drivers via 5x
user-supplied precision resistor.
During the burst read operation, the data-outs from the first
bursts are updated from output registers of the second rising
edge of the K# clock (starting two and half cycles later after
read command). The data-outs from the second bursts are
updated with the third rising edge of the K clock. The K and
K# clocks are used to time the data-outs.
ODT (On Die Termination) feature is supported
optionally on data input, K/K#, and BWx#.
The end of top mark (A/A1/A2) is to define options.
IS61QDP2B21M36A : Don’t care ODT function
and pin connection
IS61QDP2B21M36A1 : Option1
IS61QDP2B21M36A2 : Option2
Refer to more detail description at page 6 for each
ODT option.
The device is operated with a single +1.8V power supply and
is compatible with HSTL I/O interface.
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without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such
applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
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Integrated Silicon Solution, Inc.- www.issi.com
1
Rev. B
10/02/2014