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IS43R86400F-5TLI PDF预览

IS43R86400F-5TLI

更新时间: 2024-11-27 18:28:39
品牌 Logo 应用领域
美国芯成 - ISSI 动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
29页 795K
描述
DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, TSOP2-66

IS43R86400F-5TLI 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:TSOP2,Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:8 weeks
风险等级:2.15访问模式:FOUR BANK PAGE BURST
最长访问时间:0.7 ns其他特性:PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
JESD-30 代码:R-PDSO-G66长度:22.22 mm
内存密度:536870912 bit内存集成电路类型:DDR DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:66
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

IS43R86400F-5TLI 数据手册

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®
Long-term Support  
World Class Quality  
IS43/46R86400F  
IS43/46R16320F  
32Mx16, 64Mx8  
DECEMBER 2016  
512Mb DDR SDRAM  
FEATURES  
DEVICE OVERVIEW  
•ꢀ VDDꢀandꢀVDDQ:ꢀ2.5Vꢀ±ꢀ0.2Vꢀ(-5,ꢀ-6)  
•ꢀ VDDꢀandꢀVDDQ:ꢀ2.5Vꢀ±ꢀ0.1Vꢀ(-4)  
•ꢀ SSTL_2ꢀcompatibleꢀI/O  
ISSI’sꢀ512-MbitꢀDDRꢀSDRAMꢀachievesꢀhighꢀspeedꢀdataꢀ  
transfer using pipeline architecture and two data word  
accessesꢀperꢀclockꢀcycle.ꢀTheꢀ536,870,912-bitꢀmemoryꢀ  
arrayꢀisꢀinternallyꢀorganizedꢀasꢀfourꢀbanksꢀofꢀ128Mbꢀtoꢀ  
allowꢀconcurrentꢀoperations.ꢀTheꢀpipelineꢀallowsꢀReadꢀ  
and Write burst accesses to be virtually continuous, with  
theꢀoptionꢀtoꢀconcatenateꢀorꢀtruncateꢀtheꢀbursts.ꢀTheꢀ  
programmable features of burst length, burst sequence  
andꢀCASꢀlatencyꢀenableꢀfurtherꢀadvantages.ꢀTheꢀdeviceꢀ  
isꢀavailableꢀinꢀ8-bitꢀandꢀ16-bitꢀwordꢀsize.ꢀInputꢀdataꢀisꢀ  
registeredꢀonꢀtheꢀI/OꢀpinsꢀonꢀbothꢀedgesꢀofꢀDataꢀStrobeꢀ  
signal(s),ꢀwhileꢀoutputꢀdataꢀisꢀreferencedꢀtoꢀbothꢀedgesꢀ  
ofꢀDataꢀStrobeꢀandꢀbothꢀedgesꢀofꢀCLK.ꢀCommandsꢀareꢀ  
registeredꢀonꢀtheꢀpositiveꢀedgesꢀofꢀCLK.ꢀ  
•ꢀ Double-dataꢀrateꢀarchitecture;ꢀtwoꢀdataꢀtransfersꢀ  
per clock cycle  
•ꢀ Bidirectional,ꢀdataꢀstrobeꢀ(DQS)ꢀisꢀtransmitted/  
received with data, to be used in capturing data  
at the receiver  
•ꢀ DQSꢀisꢀedge-alignedꢀwithꢀdataꢀforꢀREADsꢀandꢀ  
centre-alignedꢀwithꢀdataꢀforꢀWRITEs  
•ꢀ Differentialꢀclockꢀinputsꢀ(CKꢀand CK)  
•ꢀ DLLꢀalignsꢀDQꢀandꢀDQSꢀtransitionsꢀwithꢀCKꢀ  
transitions  
•ꢀ CommandsꢀenteredꢀonꢀeachꢀpositiveꢀCKꢀedge;ꢀ  
data and data mask referenced to both edges of  
DQS  
AnꢀAutoꢀRefreshꢀmodeꢀisꢀprovided,ꢀalongꢀwithꢀaꢀSelfꢀ  
Refreshꢀmode.ꢀAllꢀI/OsꢀareꢀSSTL_2ꢀcompatible.  
•ꢀ Fourꢀinternalꢀbanksꢀforꢀconcurrentꢀoperation  
ADDRESS TABLE  
•ꢀ DataꢀMaskꢀforꢀwriteꢀdata.ꢀDMꢀmasksꢀwriteꢀdataꢀ  
Parameter  
32M x 16  
64M x 8  
at both rising and falling edges of data strobe  
Configuration 8Mꢀxꢀ16ꢀxꢀ4ꢀ  
16Mꢀxꢀ8ꢀxꢀ4ꢀ  
•ꢀ BurstꢀLength:ꢀ2,ꢀ4ꢀandꢀ8  
banks  
banks  
•ꢀ BurstꢀType:ꢀSequentialꢀandꢀInterleaveꢀmode  
•ꢀ ProgrammableꢀCASꢀlatency:ꢀ2,ꢀ2.5ꢀandꢀ3ꢀ  
•ꢀ AutoꢀRefreshꢀandꢀSelfꢀRefreshꢀModes  
•ꢀ AutoꢀPrecharge  
BankꢀAddressꢀ BA0,ꢀBA1  
Pins  
BA0,ꢀBA1  
Autoprecharge A10/AP  
Pins  
A10/AP  
RowꢀAddress 8K(A0ꢀ–ꢀA12) 8K(A0ꢀ–ꢀA12)  
OPTIONS  
•ꢀ Configuration(s):ꢀ32Mx16,ꢀ64Mx8  
Column  
Address  
1K(A0ꢀ–ꢀA9)  
2K(A0ꢀ–ꢀA9,ꢀ  
A11)  
•ꢀ Package(s):ꢀ  
66-pinꢀTSOP-IIꢀ  
ꢀ 60-ballꢀBGA  
RefreshꢀCount  
Com./Ind./A1 8Kꢀ/ꢀ64ms  
A2 8Kꢀ/ꢀ16ms  
8Kꢀ/ꢀ64ms  
8Kꢀ/ꢀ16ms  
•ꢀ Lead-freeꢀpackageꢀavailable  
•ꢀ TemperatureꢀRange:ꢀ  
ꢀ Commercialꢀ(0°Cꢀtoꢀ+70°C)  
ꢀ Industrialꢀ(-40°Cꢀtoꢀ+85°C)  
Automotive,ꢀA1ꢀ(-40°Cꢀtoꢀ+85°C)  
Automotive,ꢀA2ꢀ(-40°Cꢀtoꢀ+105°C)  
KEY TIMING PARAMETERS  
Speed Grade  
-4  
-5  
-6  
Units  
MHz  
MHz  
MHz  
F
F
F
ckꢀMaxꢀCLꢀ=ꢀ3ꢀ ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ250ꢀꢀꢀꢀꢀꢀꢀ200ꢀꢀꢀꢀꢀꢀꢀꢀ167ꢀ  
ckꢀMaxꢀCLꢀ=ꢀ2.5ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ167ꢀꢀꢀꢀꢀꢀꢀꢀ167ꢀꢀꢀꢀꢀꢀꢀ167ꢀ  
ckꢀMaxꢀCLꢀ=ꢀ2ꢀ ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ133ꢀꢀꢀꢀꢀꢀꢀꢀ133ꢀꢀꢀꢀꢀꢀꢀ133ꢀ  
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without  
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest  
version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-  
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications  
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:  
a.) the risk of injury or damage has been minimized;  
b.) the user assume all such risks; and  
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances  
Integrated Silicon Solution, Inc.  
1
Rev. A  
12/02/2016  

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