IS42VM83200D / IS42VM16160D / IS42VM32800D
32Mx8, 16Mx16, 8Mx32
256Mb Mobile Synchronous DRAM
Preliminary Information
AUGUST 2010
DESCRIPTION
FEATURES
ISSI's 256Mb Mobile Synchronous DRAM achieves high-
speed data transfer using pipeline architecture. All input
and output signals refer to the rising edge of the clock
input. Both write and read accesses to the SDRAM are
burst oriented. The 256Mb Mobile Synchronous DRAM
is designed to minimize current consumption making it
ideal for low-power applications. Both TSOP and BGA
packages are offered, including industrial grade products.
•ꢀ Fully synchronous; all signals referenced to a
positive clock edge
•ꢀ Internal bank for hiding row access and pre-
charge
•ꢀ Programmable CAS latency: 2, 3
•ꢀ Programmable Burst Length: 1, 2, 4, 8, and Full
Page
•ꢀ Programmable Burst Sequence:
•ꢀ Sequential and Interleave
•ꢀ Auto Refresh (CBR)
KEY TIMING PARAMETERS
-8(1)
-10(2)
Unit
•ꢀ TCSR (Temperature Compensated Self Refresh)
Parameter
•ꢀ PASR (Partial Arrays Self Refresh): 1/16, 1/8,
CLK Cycle Time
CAS Latency = 3
CAS Latency = 2
CLK Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from CLK
CAS Latency = 3
CAS Latency = 2
1/4, 1/2, and Full
8
10
12
ns
ns
•ꢀ Deep Power Down Mode (DPD)
•ꢀ Driver Strength Control (DS): 1/4, 1/2, and Full
10
125
100
100
83
Mhz
Mhz
OPTIONS
•ꢀ Configurations:
- 32M x 8
- 16M x 16
- 8M x 32
•ꢀ Power Supply
6
9
8
ns
ns
10
IS42VMxxx – Vd d /Vd d q = 1.8V
•ꢀ Packages:
Notes:
1. Available for x8/x16 only
2. Available for x32 only
x8 / x16 –TSOP II (54), BGA (54) [x16 only]
x32 – TSOP II (86), BGA (90)
•ꢀ Temperature Range:
Commercial (0°C to +70°C)
Industrial (–40 ºC to 85 ºC)
ADDRESSING TABLE
Parameter
32M x 8
16M x 16
8M x 32
Configuration
8M x 8 x 4 banks
8K/64ms
A0-A12
4M x 16 x 4 banks
8K/64ms
A0-A12
2M x 32 x 4 banks
4K/64ms
A0-A11
Refresh Count
Row Addressing
Column Addressing
Bank Addressing
Precharge Addressing
A0-A9
A0-A8
A0-A8
BA0, BA1
A10
BA0, BA1
A10
BA0, BA1
A10
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be
expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated
Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. - www.issi.com
Rev. 00D
1
08/06/2010