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IRGBC20MD2-S PDF预览

IRGBC20MD2-S

更新时间: 2024-11-04 22:32:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管晶体管电动机控制双极性晶体管超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
8页 384K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE(Vces=600V, @Vge=15V, Ic=8.0A)

IRGBC20MD2-S 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD - 9.1141  
IRGBC20MD2-S  
INSULATED GATE BIPOLAR TRANSISTOR  
WITH ULTRAFAST SOFT RECOVERY DIODE  
Short Circuit Rated  
Fast CoPack IGBT  
C
Features  
• Short circuit rated -10µs @125°C, V GE = 15V  
• Switching-loss rating includes all "tail" losses  
• HEXFREDTM soft ultrafast diodes  
• Optimized for medium operating frequency ( 1 to  
10kHz) See Fig. 1 for Current vs. Frequency curve  
VCES = 600V  
V
CE(sat) 2.5V  
G
@VGE = 15V, IC = 8.0A  
E
n-channel  
Description  
Co-packaged IGBTs are a natural extension of International Rectifier's well  
known IGBT line. They provide the convenience of an IGBT and an ultrafast  
recovery diode in one package, resulting in substantial benefits to a host of  
high-voltage, high-current, applications.  
These new short circuit rated devices are especially suited for motor control  
and other applications requiring short circuit withstand capability.  
SMD-220  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current  
600  
V
IC @ TC = 25°C  
13  
IC @ TC = 100°C  
8.0  
ICM  
26  
A
ILM  
Clamped Inductive Load Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Short Circuit Withstand Time  
Gate-to-Emitter Voltage  
26  
IF @ TC = 100°C  
7.0  
IFM  
26  
tsc  
10  
± 20  
µs  
V
VGE  
PD @ TC = 25°C  
Maximum Power Dissipation  
60  
W
PD @ TC = 100°C Maximum Power Dissipation  
24  
TJ  
Operating Junction and  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf•in (1.1 N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Min.  
Typ.  
Max.  
Units  
RθJC  
RθJC  
RθJA  
RθJA  
Wt  
2.1  
3.5  
40  
80  
Junction-to-Case - Diode  
Junction-to-Ambient, (PCB Mount)**  
Junction-to-Ambient, typical socket mount  
Weight  
°C/W  
2 (0.07)  
g (oz)  
** When mounted on 1" square PCB (FR-4 or G-10 Material)  
For recommended footprint and soldering techniques refer to application note #AN-994.  
Revision 2  
C-365  
To Order  
 

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