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IRFP048RPBF

更新时间: 2024-11-24 11:09:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 1895K
描述
Power MOSFET

IRFP048RPBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-247AC
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:10 weeks风险等级:5.07
雪崩能效等级(Eas):200 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):70 A最大漏极电流 (ID):70 A
最大漏源导通电阻:0.018 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-247ACJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):190 W最大脉冲漏极电流 (IDM):290 A
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFP048RPBF 数据手册

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IRFP048R, SiHFP048R  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
60  
Available  
• Isolated Central Mounting Hole  
RDS(on) (Ω)  
VGS = 10 V  
0.018  
RoHS*  
• 175 °C Operating Temperature  
• Ease of Paralleling  
COMPLIANT  
Qg (Max.) (nC)  
110  
29  
Q
Q
gs (nC)  
gd (nC)  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
38  
Configuration  
Single  
DESCRIPTION  
D
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
TO-247  
G
The TO-247 package is preferred for commercial-industrial  
applications where higher power levels preclude the use of  
TO-220 devices. The TO-247 is similar but superior to the  
earlier TO-218 package because its isolated mounting hole.  
It also provides greater creepage distances between pins to  
meet the requirements of most safety specifications.  
S
D
S
G
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
TO-247  
IRFP048RPbF  
SiHFP048R-E3  
IRFP048R  
Lead (Pb)-free  
SnPb  
SiHFP048R  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
60  
V
VGS  
20  
Continuous Drain Currente  
TC = 25 °C  
TC =100°C  
70  
52  
VGS at 10 V  
ID  
A
Continuous Drain Current  
Pulsed Drain Currenta  
IDM  
290  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
1.3  
W/°C  
mJ  
EAS  
PD  
200  
Maximum Power Dissipation  
TC = 25 °C  
190  
W
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
4.5  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d  
- 55 to + 175  
300  
°C  
for 10 s  
10  
lbf · in  
N · m  
Mounting Torque  
6-32 or M3 screw  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 25 V, starting TJ = 25 °C, L = 43 µH, RG = 25 Ω, IAS = 73 A (see fig. 12).  
c. ISD 72 A, dI/dt 200 A/µs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Current limited by the package (die current = 73 A)  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91199  
S-Pending-Rev. A, 16-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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