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IRFI3710 PDF预览

IRFI3710

更新时间: 2024-10-27 22:24:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 154K
描述
HEXFET Power MOSFET

IRFI3710 数据手册

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PD - 9.1387B  
IRFI3710  
PRELIMINARY  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Isolated Package  
l High Voltage Isolation = 2.5KVRMS  
l Sink to Lead Creepage Dist. = 4.8mm  
l Fully Avalanche Rated  
D
VDSS = 100V  
R
DS(on) = 0.025Ω  
G
Description  
ID = 32A  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use  
in a wide variety of applications.  
S
The TO-220 Fullpak eliminates the need for additional  
insulating hardware in commercial-industrial  
applications. The moulding compound used provides  
a high isolation capability and a low thermal resistance  
between the tab and external heatsink. This isolation  
is equivalent to using a 100 micron mica barrier with  
standard TO-220 product. The Fullpak is mounted to  
a heatsink using a single clip or by a single screw  
fixing.  
TO-220 FULLPAK  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current †  
32  
23  
A
180  
PD @TC = 25°C  
Power Dissipation  
63  
W
W/°C  
V
Linear Derating Factor  
0.42  
± 20  
530  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚†  
Avalanche Current†  
mJ  
A
28  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ†  
Operating Junction and  
6.3  
mJ  
V/ns  
5.0  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
–––  
Max.  
2.4  
Units  
RθJC  
RθJA  
°C/W  
–––  
65  
3/16/98  

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