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IRFG5110 PDF预览

IRFG5110

更新时间: 2024-11-19 22:51:39
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 396K
描述
100V, Combination 2N-2P-CHANNEL

IRFG5110 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, MO-036AB, 14 PINReach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.46
其他特性:HIGH RELIABILITY雪崩能效等级(Eas):75 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):1 A最大漏极电流 (ID):1 A
最大漏源导通电阻:0.8 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MO-036ABJESD-30 代码:R-CDIP-T14
JESD-609代码:e0元件数量:4
端子数量:14工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL AND P-CHANNEL
最大脉冲漏极电流 (IDM):4 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRFG5110 数据手册

 浏览型号IRFG5110的Datasheet PDF文件第2页浏览型号IRFG5110的Datasheet PDF文件第3页浏览型号IRFG5110的Datasheet PDF文件第4页浏览型号IRFG5110的Datasheet PDF文件第5页浏览型号IRFG5110的Datasheet PDF文件第6页浏览型号IRFG5110的Datasheet PDF文件第7页 
PD - 90437D  
IRFG5110  
100V, Combination 2N-2P-CHANNEL  
HEXFET® MOSFETTECHNOLOGY  
POWER MOSFET  
THRU-HOLE (MO-036AB)  
Product Summary  
Part Number  
IRFG5110  
IRFG5110  
RDS(on)  
0.7Ω  
ID  
CHANNEL  
1.0A  
-1.0A  
N
P
0.7Ω  
HEXFET® MOSFET technology is the key to International  
Rectifier’s advanced line of power MOSFET transistors. The  
efficient geometry design achieves very low on-state resis-  
tance combined with high transconductance. HEXFET tran-  
sistors also feature all of the well-established advantages  
of MOSFETs, such as voltage control, very fast switching,  
ease of paralleling and electrical parameter temperature  
stability. They are well-suited for applications such as switch-  
ing power supplies, motor controls, inverters, choppers,  
audio amplifiers, high energy pulse circuits, and virtually  
any application where high reliability is required. The  
HEXFET transistor’s totally isolated package eliminates the  
need for additional isolating material between the device  
and the heatsink. This improves thermal efficiency and  
reduces drain capacitance.  
MO-036AB  
Features:  
n Simple Drive Requirements  
n Ease of Paralleling  
n Hermetically Sealed  
n Electrically Isolated  
n Dynamic dv/dt Rating  
n Light-weight  
Absolute Maximum Ratings (Per Die)  
Parameter  
=± 10V, T = 25°C Continuous Drain Current  
C
N-Channel  
1.0  
P-Channel  
-1.0  
Units  
I
@ V  
@ V  
D
GS  
A
I
=± 10V, T = 100°C Continuous Drain Current  
0.6  
-0.6  
D
GS  
C
I
Pulsed Drain Current  
Max. Power Dissipation  
Linear Derating Factor  
4.0  
-4.0  
DM  
@ T = 25°C  
P
1.4  
1.4  
W
W/°C  
V
D
C
0.011  
±20  
0.011  
±20  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current ➀  
GS  
E
75 ➀  
75➀  
mJ  
A
AS  
I
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt  
Operating Junction  
mJ  
V/ns  
AR  
dv/dt  
5.5 ➀  
-5.5 ➀  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Lead Temperature  
Weight  
300 (0.63 in./1.6 mm from case for 10s)  
1.3 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
04/16/02  

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