November 2001
IRF710B/IRFS710B
400V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supplies and
electronic lamp ballasts based on half bridge.
•
•
•
•
•
•
2.0A, 400V, R
= 3.4Ω @V = 10 V
DS(on) GS
Low gate charge ( typical 7.7 nC)
Low Crss ( typical 6.0 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
G
TO-220
IRF Series
TO-220F
IRFS Series
G
D S
G D
S
S
Absolute Maximum Ratings
T = 25°C unless otherwise noted
C
Symbol
Parameter
IRF710B
IRFS710B
Units
V
V
I
Drain-Source Voltage
400
DSS
- Continuous (T = 25°C)
Drain Current
2.0
1.3
6.0
2.0 *
1.3 *
6.0 *
A
D
C
- Continuous (T = 100°C)
A
C
I
(Note 1)
Drain Current
- Pulsed
A
DM
V
E
I
Gate-Source Voltage
± 30
100
2.0
V
GSS
AS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
3.6
mJ
V/ns
W
AR
dv/dt
5.5
P
Power Dissipation (T = 25°C)
36
23
D
C
- Derate above 25°C
Operating and Storage Temperature Range
0.29
0.19
W/°C
°C
T , T
-55 to +150
300
J
STG
Maximum lead temperature for soldering purposes,
T
°C
L
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
Parameter
IRF710B
IRFS710B
5.37
Units
°C/W
°C/W
°C/W
R
R
R
Thermal Resistance, Junction-to-Case Max.
Thermal Resistance, Case-to-Sink Typ.
3.44
0.5
θJC
--
θCS
Thermal Resistance, Junction-to-Ambient Max.
62.5
62.5
θJA
©2001 Fairchild Semiconductor Corporation
Rev. A, November 2001