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IRF1324PBF PDF预览

IRF1324PBF

更新时间: 2024-11-05 11:09:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲PC局域网
页数 文件大小 规格书
8页 452K
描述
HEXFETPower MOSFET

IRF1324PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE, PLASTIC PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.38Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:804397
Samacsys Pin Count:3Samacsys Part Category:MOSFET (N-Channel)
Samacsys Package Category:Transistor Outline, VerticalSamacsys Footprint Name:TO-220AB*
Samacsys Released Date:2020-04-23 03:08:02Is Samacsys:N
雪崩能效等级(Eas):270 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:24 V最大漏极电流 (Abs) (ID):353 A
最大漏极电流 (ID):195 A最大漏源导通电阻:0.0015 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):300 W最大脉冲漏极电流 (IDM):1412 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF1324PBF 数据手册

 浏览型号IRF1324PBF的Datasheet PDF文件第2页浏览型号IRF1324PBF的Datasheet PDF文件第3页浏览型号IRF1324PBF的Datasheet PDF文件第4页浏览型号IRF1324PBF的Datasheet PDF文件第5页浏览型号IRF1324PBF的Datasheet PDF文件第6页浏览型号IRF1324PBF的Datasheet PDF文件第7页 
PD - 96199A  
IRF1324PbF  
HEXFET® Power MOSFET  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
l Uninterruptible Power Supply  
l High Speed Power Switching  
D
S
VDSS  
RDS(on) typ.  
max.  
24V  
1.2m  
1.5m  
353A  
195A  
l Hard Switched and High Frequency Circuits  
G
ID (Silicon Limited)  
ID  
(Package Limited)  
Benefits  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
S
D
G
TO-220AB  
IRF1324PbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Parameter  
Max.  
353  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
249  
A
195  
1412  
300  
PD @TC = 25°C  
Maximum Power Dissipation  
W
W/°C  
V
2.0  
Linear Derating Factor  
VGS  
dv/dt  
TJ  
± 20  
0.46  
Gate-to-Source Voltage  
Peak Diode Recovery  
V/ns  
Operating Junction and  
-55 to + 175  
300  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
Avalanche Characteristics  
EAS (Thermally limited)  
270  
Single Pulse Avalanche Energy  
mJ  
A
IAR  
See Fig. 14, 15, 22a, 22b  
Avalanche Current  
EAR  
Repetitive Avalanche Energy  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.50  
–––  
62  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
0.50  
–––  
www.irf.com  
1
09/24/09  

IRF1324PBF 替代型号

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