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IR2128C PDF预览

IR2128C

更新时间: 2024-10-28 20:01:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
17页 142K
描述
Buffer/Inverter Based MOSFET Driver, CMOS,

IR2128C 技术参数

是否Rohs认证: 不符合生命周期:End Of Life
包装说明:, DIE OR CHIPReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.7接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER
最高工作温度:125 °C最低工作温度:-40 °C
封装等效代码:DIE OR CHIP电源:15 V
认证状态:Not Qualified子类别:MOSFET Drivers
标称供电电压:15 V技术:CMOS
温度等级:AUTOMOTIVEBase Number Matches:1

IR2128C 数据手册

 浏览型号IR2128C的Datasheet PDF文件第2页浏览型号IR2128C的Datasheet PDF文件第3页浏览型号IR2128C的Datasheet PDF文件第4页浏览型号IR2128C的Datasheet PDF文件第5页浏览型号IR2128C的Datasheet PDF文件第6页浏览型号IR2128C的Datasheet PDF文件第7页 
Data Sheet No. PD65003  
IR2127C/IR2128C/IR21271C  
CURRENT SENSING SINGLE CHANNEL DRIVERDIE IN  
WAFER FORM  
Features  
c
100 % Tested at Probe  
d
Available in Chip Pack, Unsawn Wafer, Sawn on Film  
Floating channel designed for bootstrap operation  
Fully operational to +600V  
Tolerant to negative transient voltage dV/dt immune  
Application- specific gate drive range: Motor Drive: 12 to 20V (IR2127/IR2128)  
Automotive: 9 to 20V (IR21271)  
Undervoltage lockout  
3.3V, 5V and 15V input logic compatible  
FAULT  
lead indicates shutdown has occured  
Output in phase with input (IR2127/IR21271)  
Output out of phase with input (IR2128)  
Typical Connection  
VCC  
IN  
VCC  
VB  
HO  
CS  
VS  
IN  
FAULT  
FAULT  
COM  
VCC  
IN  
VCC  
VB  
HO  
CS  
VS  
IR2127/IR21271  
IN  
(Refer to the Die Outlines for correct pin  
configuration). This/These diagram(s) show  
electrical connections only. Please refer to  
our Application Notes and DesignTips for  
proper circuit board layout.  
FAULT  
FAULT  
COM  
IR2128  
Notes:  
c This IR product is100% tested at wafer level and is manufactured using established, mature and well characterized  
processes. Due to restrictions in die level processing, die may not be equivalent to standard package products and are  
therefore offered with a conditional performance guarantee. The above data sheet is based on IR sample testing under  
certain predetermined and assumed conditions, and are provided for illustration purposes only. Customers are encouraged  
to perform testing in actual proposed packaged and use conditions. IR die products are tested using IR-based quality  
assurance procedures and are manufactured using IR’s established processes. Programs for customer-specified testing  
are available upon request. IR has experienced assembly yields of generally 95% or greater for individual die; however,  
customer’s results will vary. Estimates such as those described and set forth in this data sheet for semiconductor die will  
vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an equivalent  
basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable  
standard terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale,  
which are available upon request. For customers requiring a particular parameter to be guaranteed, special testing can be  
carried out or product can be purchased as known good die.  
d Part number shown is for die in wafer. Contact factory for these other options.  
www.irf.com  
1

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