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IDT70V631S12BFI8 PDF预览

IDT70V631S12BFI8

更新时间: 2024-10-28 14:42:43
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
23页 182K
描述
Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208

IDT70V631S12BFI8 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Active零件包装代码:BGA
包装说明:LFBGA, BGA208,17X17,32针数:208
Reach Compliance Code:not_compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.13
Is Samacsys:N最长访问时间:12 ns
I/O 类型:COMMONJESD-30 代码:S-PBGA-B208
JESD-609代码:e0长度:15 mm
内存密度:4718592 bit内存集成电路类型:DUAL-PORT SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端口数量:2
端子数量:208字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX18输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA208,17X17,32封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):225电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.7 mm
最大待机电流:0.015 A最小待机电流:3.15 V
子类别:SRAMs最大压摆率:0.515 mA
最大供电电压 (Vsup):3.45 V最小供电电压 (Vsup):3.15 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn63Pb37)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:15 mm
Base Number Matches:1

IDT70V631S12BFI8 数据手册

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PRELIMINARY  
IDT70V631S  
HIGH-SPEED 3.3V 256K x 18  
ASYNCHRONOUS DUAL-PORT  
STATIC RAM  
Features  
True Dual-Port memory cells which allow simultaneous  
access of the same memory location  
High-speed access  
Fully asynchronous operation from either port  
Separate byte controls for multiplexed bus and bus  
matching compatibility  
Supports JTAG features compliant to IEEE 1149.1  
Due to limited pin count, JTAG is not supported on the  
128-pin TQFP package.  
– Commercial:10/12/15ns (max.)  
Industrial:12/15ns (max.)  
Dual chip enables allow for depth expansion without  
external logic  
IDT70V631 easily expands data bus width to 36 bits or  
more using the Master/Slave select when cascading more  
than one device  
M/S = VIH for BUSY output flag on Master,  
M/S = VIL for BUSY input on Slave  
Busy and Interrupt Flags  
LVTTL-compatible, single 3.3V (±150mV) power supply for  
core  
LVTTL-compatible, selectable 3.3V (±150mV)/2.5V (±100mV)  
power supply for I/Os and control signals on each port  
Available in a 128-pin Thin Quad Flatpack, 208-ball fine  
pitch Ball Grid Array, and 256-ball Ball Grid Array  
Industrial temperature range (–40°C to +85°C) is available  
for selected speeds  
On-chip port arbitration logic  
Full on-chip hardware support of semaphore signaling  
between ports  
Functional Block Diagram  
UBL  
R
UB  
LBL  
LB  
R
R/W  
L
R/W  
R
B
E
0
L
B
E
1
L
B
E
1
B
E
0
0L  
CE  
0R  
CE  
R
R
CE1L  
CE1R  
OEL  
OER  
Dout0-8_L  
Dout0-8_R  
Dout9-17_L  
Dout9-17_R  
256K x 18  
MEMORY  
ARRAY  
Din_L  
I/O0L- I/O17L  
Din_R  
I/O0R - I/O17R  
17R  
0R  
A
Address  
Decoder  
Address  
Decoder  
17L  
A
ADDR_L  
ADDR_R  
A
0L  
A
OEL  
ARBITRATION  
OER  
INTERRUPT  
SEMAPHORE  
LOGIC  
0R  
CE  
0L  
CE  
CE1L  
CE1R  
R/WL  
R/WR  
BUSYR  
BUSYL  
SEML  
M/  
S
SEMR  
INTR  
INTL  
TMS  
TCK  
TDI  
JTAG  
TDO  
TRST  
5622 drw 01  
NOTES:  
1. BUSY is an input as a Slave (M/S=VIL) and an output when it is a Master (M/S=VIH).  
2. BUSY and INT are non-tri-state totem-pole outputs (push-pull).  
AUGUST 2001  
1
DSC-5622/4  
©2001IntegratedDeviceTechnology,Inc.  

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