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HYMD564M646L6-H PDF预览

HYMD564M646L6-H

更新时间: 2024-11-11 15:34:27
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
16页 242K
描述
DDR DRAM Module, 64MX64, 0.75ns, CMOS, 67.60 X 31.75 X 1 MM, SODIMM-200

HYMD564M646L6-H 技术参数

生命周期:Obsolete零件包装代码:MODULE
包装说明:DIMM,针数:200
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.84
访问模式:DUAL BANK PAGE BURST最长访问时间:0.75 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-XDMA-N200
内存密度:4294967296 bit内存集成电路类型:DDR DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:200
字数:67108864 words字数代码:64000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:64MX64
封装主体材料:UNSPECIFIED封装代码:DIMM
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:DUAL
Base Number Matches:1

HYMD564M646L6-H 数据手册

 浏览型号HYMD564M646L6-H的Datasheet PDF文件第2页浏览型号HYMD564M646L6-H的Datasheet PDF文件第3页浏览型号HYMD564M646L6-H的Datasheet PDF文件第4页浏览型号HYMD564M646L6-H的Datasheet PDF文件第5页浏览型号HYMD564M646L6-H的Datasheet PDF文件第6页浏览型号HYMD564M646L6-H的Datasheet PDF文件第7页 
64Mx64 bits  
Unbuffered DDR SO-DIMM  
HYMD564M646(L)6-K/H/L  
DESCRIPTION  
Preliminary  
Hynix HYMD564M646(L)6-K/H/L series is unbuffered 200-pin double data rate Synchronous DRAM Small Outline  
Dual In-Line Memory Modules (SO-DIMMs) which are organized as 64Mx64 high-speed memory arrays. Hynix  
HYMD564M646(L)6-K/H/L series consists of eight 32Mx16 DDR SDRAM in 400mil TSOP II packages on a 200pin  
glass-epoxy substrate. Hynix HYMD564M646(L)6-K/H/L series provide a high performance 8-byte interface in  
67.60mmX 31.75mm form factor of industry standard. It is suitable for easy interchange and addition.  
Hynix HYMD564M646(L)6-K/H/L series is designed for high speed of up to 133MHz and offers fully synchronous oper-  
ations referenced to both rising and falling edges of differential clock inputs. While all addresses and control inputs are  
latched on the rising edges of the clock, Data, Data strobes and Write data masks inputs are sampled on both rising  
and falling edges of it. The data paths are internally pipelined and 2-bit prefetched to achieve very high bandwidth. All  
input and output voltage levels are compatible with SSTL_2. High speed frequencies, programmable latencies and  
burst lengths allow variety of device operation in high performance memory system.  
Hynix HYMD564M646(L)6-K/H/L series incorporates SPD(serial presence detect). Serial presence detect function is  
implemented via a serial 2,048-bit EEPROM. The first 128 bytes of serial PD data are programmed by Hynix to identify  
DIMM type, capacity and other the information of DIMM and the last 128 bytes are available to the customer.  
FEATURES  
512MB (64M x 64) Unbuffered DDR SO-DIMM  
both rising and falling edges of the clock  
based on 32Mx16 DDR SDRAM  
Data inputs on DQS centers when write (centered  
DQ)  
JEDEC Standard 200-pin small outline dual in-line  
memory module (SO-DIMM)  
Data strobes synchronized with output data for read  
and input data for write  
2.5V +/- 0.2V VDD and VDDQ Power supply  
All inputs and outputs are compatible with SSTL_2  
interface  
Programmable CAS Latency 1.5 / 2 / 2.5 supported  
Programmable Burst Length 2 / 4 / 8 with both  
sequential and interleave mode  
Fully differential clock operations (CK & /CK) with  
100MHz/125MHz/133MHz  
tRAS Lock-out function supported  
All addresses and control inputs except Data, Data  
strobes and Data masks latched on the rising edges  
of the clock  
Internal four bank operations with single pulsed RAS  
Auto refresh and self refresh supported  
8192 refresh cycles / 64ms  
Data(DQ), Data strobes and Write masks latched on  
ORDERING INFORMATION  
Part No.  
Power Supply  
Clock Frequency  
Interface  
Form Pactor  
HYMD564M646(L)6-K  
HYMD564M646(L)6-H  
HYMD564M646(L)6-L  
133MHz (*DDR266A)  
133MHz (*DDR266B)  
125MHz (*DDR200)  
VDD=2.5V  
VDDQ=2.5V  
200pin Unbuffered SO-DIMM  
67.6mm x 31.75mm x 1mm  
SSTL_2  
* JEDEC Defined Specifications compliant  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.2/Jul. 02  
1

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