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HY5Y5A6DF-HF PDF预览

HY5Y5A6DF-HF

更新时间: 2024-01-07 00:56:56
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器内存集成电路
页数 文件大小 规格书
25页 214K
描述
Synchronous DRAM, 16MX16, 5.4ns, CMOS, PBGA54

HY5Y5A6DF-HF 技术参数

生命周期:Obsolete包装说明:FBGA, BGA54,9X9,32
Reach Compliance Code:unknown风险等级:5.84
最长访问时间:5.4 ns最大时钟频率 (fCLK):133 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:S-PBGA-B54内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
端子数量:54字数:16777216 words
字数代码:16000000最高工作温度:70 °C
最低工作温度:-25 °C组织:16MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装等效代码:BGA54,9X9,32
封装形状:SQUARE封装形式:GRID ARRAY, FINE PITCH
电源:3/3.3 V认证状态:Not Qualified
刷新周期:8192连续突发长度:1,2,4,8,FP
最大待机电流:0.00035 A子类别:DRAMs
最大压摆率:0.18 mA表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOMBase Number Matches:1

HY5Y5A6DF-HF 数据手册

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Preliminary  
HY5Y5A6D(L/S)F(P)-xF  
4Banks x 4M x 16bits Synchronous DRAM  
DESCRIPTION  
The Hynix Low Power SDRAM is suited for non-PC application which use the batteries such as PDAs, 2.5G and 3G cellular  
phones with internet access and multimedia capabilities, mini-notebook, handheld PCs.  
The Hynix HY5Y5A6D(L/S)F(P) is a 268,435,456bit CMOS Synchronous Dynamic Random Access Memory. It is organ-  
ized as 4banks of 4,194,304x16.  
The Low Power SDRAM provides for programmable options including CAS latency of 1, 2, or 3, READ or WRITE burst  
length of 1, 2, 4, 8, or full page, and the burst count sequence(sequential or interleave). And the Low Power SDRAM  
also provides for special programmable options including Partial Array Self Refresh of a quarter bank, a half bank,  
1bank, 2banks, or all banks, Temperature Compensated Self Refresh of 15, 45, 70, or 85 degrees oC. A burst of Read  
or Write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a  
new burst Read or Write command on any cycle(This pipelined design is not restricted by a 2N rule).  
Deep Power Down Mode is a additional operating mode for Low Power SDRAM. This mode can achieve maximum power  
reduction by removing power to the memory array within each SDRAM. By using this feature, the system can cut off  
alomost all DRAM power without adding the cost of a power switch and giving up mother-board power-line layout  
flexibility.  
FEATURES  
Standard SDRAM Protocol  
Internal 4bank operation  
Power Supply Voltage : VDD = 3.0V, VDDQ = 3.0V  
LVCMOS compatible I/O Interface  
Low Voltage interface to reduce I/O power  
Low Power Features  
- PASR(Partial Array Self Refresh)  
- TCSR (Temperature Compensated Self Refresh)  
- DS (Drive Strength)  
- Deep Power Down Mode  
Programmable CAS latency of 1, 2 or 3  
-25oC ~ 70oC Operation  
Package Type : 54ball, 0.8mm pitch FBGA (Lead Free, Lead)  
HY5Y5A6D(L/S)FP : Lead Free  
HY5Y5A6D(L/S)F : Lead  
256M SDRAM ORDERING INFORMATION  
CAS  
Latency  
Part Number  
Clock Frequency  
Organization  
Interface 54Ball FBGA  
HY5Y5A6D(L/S)F-HF  
HY5Y5A6D(L/S)FP-HF  
Lead  
LVCMOS  
133MHz  
3
4banks x 4Mb x 16  
Lead Free  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 0.3 / Aug. 2003  
1

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