生命周期: | Active | 零件包装代码: | DFP |
包装说明: | DFP, | 针数: | 40 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.34 |
Is Samacsys: | N | 其他特性: | ALSO OPERATES WITH 3V TO 3.6V SUPPLY |
JESD-30 代码: | R-CDFP-F40 | 长度: | 25.65 mm |
内存密度: | 16777216 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 40 | 字数: | 2097152 words |
字数代码: | 2000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 2MX8 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DFP | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 筛选级别: | MIL-PRF-38535 |
座面最大高度: | 3.13 mm | 最大供电电压 (Vsup): | 1.95 V |
最小供电电压 (Vsup): | 1.65 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | FLAT |
端子节距: | 1.27 mm | 端子位置: | DUAL |
宽度: | 21.67 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
HXSR01608-EH | HONEYWELL |
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IC 2M X 8 STANDARD SRAM, CUUC3, CERAMIC, DIE-3, Static RAM | |
HXSR01608-EN | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01608-QN | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01608-VH | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01608-VN | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01608-YN | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01608-ZN | HONEYWELL |
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Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3 | |
HXSR01632DQN | HONEYWELL |
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Standard SRAM, 512KX32, 22ns, CMOS, CDFP86, DFP-86 | |
HXSR01632DVH | HONEYWELL |
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Standard SRAM, 512KX32, 22ns, CMOS, PDFP86, CERAMIC, DFP-86 | |
HXSR01632DZN | HONEYWELL |
获取价格 |
Standard SRAM, 512KX32, 22ns, CMOS, CDFP86, DFP-86 |