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HXSR01608-YN PDF预览

HXSR01608-YN

更新时间: 2024-11-21 18:34:35
品牌 Logo 应用领域
霍尼韦尔 - HONEYWELL 静态存储器内存集成电路
页数 文件大小 规格书
11页 258K
描述
Standard SRAM, 2MX8, CMOS, CUUC3, CERAMIC, DIE-3

HXSR01608-YN 技术参数

生命周期:Active零件包装代码:DIE
包装说明:DIE,针数:3
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.41风险等级:5.75
其他特性:ALSO OPERATES WITH 3V TO 3.6V SUPPLYJESD-30 代码:R-CUUC-N3
内存密度:16777216 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:3字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:2MX8封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIE封装形状:RECTANGULAR
封装形式:UNCASED CHIP并行/串行:PARALLEL
认证状态:Not Qualified最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:NO LEAD
端子位置:UPPERBase Number Matches:1

HXSR01608-YN 数据手册

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HXSR01608  
2M x 8 STATIC RAM  
The monolithic, radiation hardened 16M bit Static  
Random Access Memory (SRAM) in a 2M x 8  
configuration is a high performance 2,097,152 word x 8  
bit SRAM fabricated with Honeywell’s 150nm silicon-  
on-insulator CMOS (S150) technology. It is designed  
for use in low voltage systems operating in radiation  
sensitive environments. The RAM operates over the full  
military temperature range and requires a core supply  
voltage of 1.8V +/- 0.15V and an I/O supply voltage of  
3.3V ± 0.3V or 2.5V ± 0.2V.  
proprietary design, layout and process hardening  
techniques. There is no internal EDAC implemented.  
It is a low power process with a minimum drawn feature  
size of 150 nm. Less than 150mW typical power at  
40MHz operation. The SRAM is fully asynchronous  
with a typical access time of 13 ns at 3.3V. A seven  
transistor (7T) memory cell is used for superior single  
event upset hardening, while four layer metal power  
busing and the low collection volume SOI substrate  
provide improved dose rate hardening.  
Honeywell’s state-of-the-art S150 technology is  
radiation hardened through the use of advanced and  
FEATURES  
· Fabricated on S150 Silicon On  
Insulator (SOI) CMOS  
· Total Dose =1X106 rad(Si)  
· Soft Error Rate  
· Core Power Supply  
1.8 V ± 0.15 V  
Heavy Ion =1x10-12 Upsets/bit-day  
Proton = 2x10-12 Upsets/bit-day  
· 150 nm Process (Leff = 110 nm)  
· I/O Power Supply  
3.3 V ± 0.3 V  
· Read Cycle Times  
Typical =13 ns  
2.5 V ± 0.2 V  
· Neutron =1x1014 cm-2  
Worst case = 20 ns  
· CMOS Compatible I/O  
· Dose Rate Upset  
=1x1010 rad(Si)/s  
· Write Cycle Times  
Typical = 9 ns  
· Operating Range is  
-55°C to +125°C  
· Dose Rate Survivability  
Worst case = 12 ns  
=1x1012 rad(Si)/s  
· 40-Lead Flat Pack Package  
· Asynchronous Operation  
· No Latchup  

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