HUF76423D3, HUF76423D3S
Data Sheet
December 2001
20A, 60V, 0.037 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFETFairchild
Packaging
Features
JEDEC TO-251AA
JEDEC TO-252AA
• Ultra Low On-Resistance
- r
- r
= 0.032Ω, VGS = 10V
= 0.037Ω, VGS = 5V
DS(ON)
DS(ON)
DRAIN
(FLANGE)
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
• Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
GATE
SOURCE
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
HUF76423D3S
HUF76423D3
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs R
Curves
Symbol
GS
Ordering Information
D
S
PART NUMBER
HUF76423D3
PACKAGE
BRAND
76423D
76423D
TO-251AA
TO-252AA
G
HUF76423D3S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF76423D3ST.
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
HUF76423D3,
HUF76423D3S
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
60
60
V
V
V
DSS
DGR
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
±16
GS
Drain Current
o
Continuous (T = 25 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
20
20
20
A
A
A
A
C
GS
GS
D
D
o
Continuous (T = 25 C, V
C
o
Continuous (T = 100 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
GS
GS
D
o
Continuous (T = 100 C, V
20
C
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures 6, 17, 18
85
0.567
W
W/ C
D
o
o
o
Operating and StorageTemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
1. T = 25 C to 150 C.
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Product reliability information can be found at http://www.fairchildsemi.com/products/discrete/reliability/index.html
For severe environments, see our Automotive HUFA series.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corporation
HUF76423D3, HUF76423D3S Rev. B