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HSE-B18317-035H PDF预览

HSE-B18317-035H

更新时间: 2024-11-02 22:56:27
品牌 Logo 应用领域
CUI /
页数 文件大小 规格书
7页 521K
描述
HEAT SINK, EXTRUSION, TO-218, 31

HSE-B18317-035H 数据手册

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Additional Resources: Product Page  
|
3D Model  
date 08/17/2020  
page 1 of 7  
SERIES: HSE-B18X-035H DESCRIPTION: HEAT SINK  
FEATURES  
• TO-218 package  
• placement pins for secure PCB attachment  
• round hole for component attachment  
• multiple available cut lengths  
thermal resistance1  
power  
MODEL  
dissipation1  
length  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
(mm)  
25.4  
31.75  
38.1  
50.8  
63.5  
HSE-B18254-035H  
HSE-B18317-035H  
HSE-B18381-035H  
HSE-B18508-035H  
HSE-B18635-035H  
9.26  
7.65  
6.25  
5.86  
4.49  
13.52  
10.96  
8.34  
3.09  
3.63  
3.52  
2.98  
2.24  
2.86  
2.80  
2.48  
2.21  
1.22  
8.10  
9.80  
12.00  
12.80  
16.70  
8.63  
6.61  
Note:  
1. See performance curves for full thermal resistance details.  
2. Custom cut to length options available. Thermal data not available on custom lengths.  
PERFORMANCE CURVES  
HSE-B18254-035H  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Without Airflow  
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
200 LFM  
400 LFM  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
0
0
0
13.52  
24.58  
33.71  
42.65  
51.54  
58.98  
67.25  
74.76  
82.16  
89.43  
3.09  
2.86  
2
6.19  
4.94  
3
9.47  
7.42  
4
12.64  
15.85  
18.94  
22.34  
25.54  
28.87  
31.89  
9.60  
5
12.11  
14.54  
16.84  
19.31  
21.66  
23.95  
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10  
10  
Dissipated Power (W)  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
cuidevices.com  

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