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HCTS365D

更新时间: 2024-11-01 22:49:35
品牌 Logo 应用领域
英特矽尔 - INTERSIL 驱动器
页数 文件大小 规格书
10页 203K
描述
Radiation Hardened Hex Buffer/Line Driver Non-Inverting

HCTS365D 数据手册

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HCTS365MS  
Radiation Hardened  
Hex Buffer/Line Driver Non-Inverting  
September 1995  
Features  
Pinouts  
16 LEAD CERAMIC DUAL-IN-LINE  
METAL SEAL PACKAGE (SBDIP)  
MIL-STD-1835 CDIP2-T16, LEAD FINISH C  
TOP VIEW  
• 3 Micron Radiation Hardened CMOS SOS  
• Total Dose 200K RAD (Si)  
• SEP Effective LET No Upsets: >100 MEV-cm2/mg  
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/  
Bit-Day (Typ)  
OE1  
A1  
1
2
3
4
5
6
7
8
16 VCC  
15 OE2  
14 A6  
13 Y6  
12 A5  
11 Y5  
10 A4  
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s  
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse  
• Latch-Up Free Under Any Conditions  
Y1  
A2  
Y2  
A3  
• Fanout (Over Temperature Range)  
- Bus Driver Outputs: 15 LSTTL Loads  
Y3  
9
Y4  
GND  
• Military Temperature Range: -55oC to +125oC  
• Significant Power Reduction Compared to LSTTL ICs  
• DC Operating Voltage Range: 4.5V to 5.5V  
16 LEAD CERAMIC METAL SEAL  
FLATPACK PACKAGE (FLATPACK)  
MIL-STD-1835 CDFP4-F16, LEAD FINISH C  
TOP VIEW  
• LSTTL Input Compatibility  
- VIL = 0.8V Max  
OE1  
A1  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VCC  
OE2  
A6  
- VIH = VCC/2 Min  
• Input Current Levels Ii 5µA @ VOL, VOH  
Y1  
A2  
Y6  
Description  
Y2  
A5  
The Intersil HCTS365MS is a Radiation Hardened non-  
inverting hex buffer and line driver with Tri-state outputs. The  
output enables (OE1 and OE2) control the three-state out-  
puts. If either OE1 or OE2 is high the outputs will be in a  
High impedance state. For Data, OE1 and OE2 must be  
Low.  
A3  
Y5  
Y3  
A4  
GND  
Y4  
The HCTS365MS utilizes advanced CMOS/SOS technology  
to achieve high-speed operation. This device is a member of  
radiation hardened, high-speed, CMOS/SOS Logic Family  
Ordering Information  
PART NUMBER  
HCTS365DMSR  
TEMPERATURE RANGE  
SCREENING LEVEL  
Intersil Class S Equivalent  
Intersil Class S Equivalent  
Sample  
PACKAGE  
16 Lead SBDIP  
o
o
-55 C to +125 C  
o
o
HCTS365KMSR  
-55 C to +125 C  
16 Lead Ceramic Flatpack  
16 Lead SBDIP  
o
HCTS365D/Sample  
HCTS365K/Sample  
HCTS365HMSR  
+25 C  
o
+25 C  
Sample  
16 Lead Ceramic Flatpack  
Die  
o
+25 C  
Die  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
Spec Number 518637  
File Number 3070.1  
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999  
1

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