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GT28F016C3B110

更新时间： 2024-11-17 22:28:11
品牌 Logo 应用领域
英特尔 - INTEL 闪存
页数 文件大小 规格书
59页 380K
描述
3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

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中文翻译

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GT28F016C3B110 数据手册

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PRODUCT PREVIEW  
E
3 VOLT ADVANCED+ BOOT BLOCK  
8-, 16-, 32-MBIT  
FLASH MEMORY FAMILY  
28F008C3, 28F016C3, 28F032C3  
28F800C3, 28F160C3, 28F320C3  
Flexible SmartVoltage Technology  
2.7 V–3.6 V Read/Program/Erase  
Easy-12 V  
Faster Production Programming  
2.7 V or 1.65 V I/O Option Reduces  
Overall System Power  
12 V for Fast Production  
Programming  
No Additional System Logic  
128-bit Protection Register  
64-bit Unique Device Identifier  
64-bit User Programmable OTP  
Cells  
High Performance  
2.7 V–3.6 V: 90 ns Max Access Time  
3.0 V–3.6 V: 80 ns Max Access Time  
Extended Cycling Capability  
Minimum 100,000 Block Erase  
Cycles  
Optimized Architecture for Code Plus  
Data Storage  
Flash Data Integrator Software  
Flash Memory Manager  
Eight 8-Kbyte Blocks,  
Top or Bottom Locations  
Up to Sixty-Three 64-KB Blocks  
Fast Program Suspend Capability  
Fast Erase Suspend Capability  
System Interrupt Manager  
Supports Parameter Storage,  
Streaming Data (e.g., voice)  
Automated Word/Byte Program and  
Block Erase  
Flexible Block Locking  
Lock/Unlock Any Block  
Full Protection on Power-Up  
WP# Pin for Hardware Block  
Protection  
Command User Interface  
Status Registers  
SRAM-Compatible Write Interface  
VPP = GND Option  
VCC Lockout Voltage  
Cross-Compatible Command Support  
Intel Basic Command Set  
Common Flash Interface  
Low Power Consumption  
9 mA Typical Read Power  
10 µA Typical Standby Power with  
Automatic Power Savings Feature  
x 16 for High Performance  
48-Ball µBGA* Package  
48-Lead TSOP Package  
Extended Temperature Operation  
–40 °C to +85 °C  
x 8 I/O for Space Savings  
48-Ball µBGA* Package  
40-Lead TSOP Package  
0.25 µ ETOX™ VI Flash Technology  
The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a  
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage  
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking  
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data  
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on  
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,  
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing  
Intel’s WWW page: http://www.intel.com/design/flcomp.  
May 1998  
Order Number: 290645-001  
1234567...59

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