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GS81302D07GE-333 PDF预览

GS81302D07GE-333

更新时间: 2024-11-30 21:03:23
品牌 Logo 应用领域
GSI 双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
31页 395K
描述
DDR SRAM, 16MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

GS81302D07GE-333 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Not Recommended零件包装代码:BGA
包装说明:LBGA,针数:165
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41Factory Lead Time:12 weeks
风险等级:5.32Is Samacsys:N
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PBGA-B165JESD-609代码:e1
长度:17 mm内存密度:134217728 bit
内存集成电路类型:DDR SRAM内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:165字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX8封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.5 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15 mmBase Number Matches:1

GS81302D07GE-333 数据手册

 浏览型号GS81302D07GE-333的Datasheet PDF文件第2页浏览型号GS81302D07GE-333的Datasheet PDF文件第3页浏览型号GS81302D07GE-333的Datasheet PDF文件第4页浏览型号GS81302D07GE-333的Datasheet PDF文件第5页浏览型号GS81302D07GE-333的Datasheet PDF文件第6页浏览型号GS81302D07GE-333的Datasheet PDF文件第7页 
GS81302D07/10/19/37E-450/400/350/333/300  
450 MHz–300 MHz  
144Mb SigmaQuad-II+TM  
Burst of 4 SRAM  
165-Bump BGA  
Commercial Temp  
Industrial Temp  
1.8 V V  
DD  
1.8 V and 1.5 V I/O  
are just one element in a family of low power, low voltage  
HSTL I/O SRAMs designed to operate at the speeds needed to  
implement economical high performance networking systems.  
Features  
• 2.0 clock Latency  
• Simultaneous Read and Write SigmaQuad™ Interface  
• JEDEC-standard pinout and package  
• Dual Double Data Rate interface  
• Byte Write controls sampled at data-in time  
• Burst of 4 Read and Write  
• On-Die Termination (ODT) on Data (D), Byte Write (BW),  
and Clock (K, K) inputs  
• 1.8 V +100/–100 mV core power supply  
• 1.5 V or 1.8 V HSTL Interface  
Clocking and Addressing Schemes  
The GS81302D07/10/19/37E SigmaQuad-II+ SRAMs are  
synchronous devices. They employ two input register clock  
inputs, K and K. K and K are independent single-ended clock  
inputs, not differential inputs to a single differential clock input  
buffer.  
• Pipelined read operation  
• Fully coherent read and write pipelines  
• ZQ pin for programmable output drive strength  
• Data Valid Pin (QVLD) Support  
• IEEE 1149.1 JTAG-compliant Boundary Scan  
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package  
• RoHS-compliant 165-bump BGA package available  
Each internal read and write operation in a SigmaQuad-II+ B4  
RAM is four times wider than the device I/O bus. An input  
data bus de-multiplexer is used to accumulate incoming data  
before it is simultaneously written to the memory array. An  
output data multiplexer is used to capture the data produced  
from a single memory array read and then route it to the  
appropriate output drivers as needed. Therefore the address  
field of a SigmaQuad-II+ B4 RAM is always two address pins  
less than the advertised index depth (e.g., the 16M x 8 has a  
4M addressable index).  
SigmaQuadFamily Overview  
The GS81302D07/10/19/37E are built in compliance with the  
SigmaQuad-II+ SRAM pinout standard for Separate I/O  
synchronous SRAMs. They are 150,994,944-bit (144Mb)  
SRAMs. The GS81302D07/10/19/37E SigmaQuad SRAMs  
Parameter Synopsis  
-450  
2.2 ns  
0.45 ns  
-400  
2.5 ns  
0.45 ns  
-350  
2.86 ns  
0.45 ns  
-333  
-300  
3.3 ns  
0.45 ns  
tKHKH  
tKHQV  
3.0 ns  
0.45 ns  
Rev: 1.04 4/2011  
1/31  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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